Nom de code de l’architecture |
Amber Lake Y |
Skylake |
Date de sortie |
Q1'21 |
1 September 2015 |
Position dans l’évaluation de la performance |
1592 |
1587 |
Processor Number |
i3-10100Y |
i3-6167U |
Série |
10th Generation Intel Core i3 Processors |
6th Generation Intel® Core™ i3 Processors |
Status |
Launched |
Launched |
Segment vertical |
Mobile |
Mobile |
Soutien de 64-bit |
|
|
Base frequency |
1.30 GHz |
2.70 GHz |
Bus Speed |
4 GT/s |
4 GT/s OPI |
Processus de fabrication |
14 nm |
14 nm |
Température de noyau maximale |
100°C |
100°C |
Fréquence maximale |
3.90 GHz |
2.7 GHz |
Cache L1 |
|
128 KB |
Cache L2 |
|
512 KB |
Cache L3 |
|
3 MB |
Nombre de noyaux |
|
2 |
Nombre de fils |
|
4 |
Réseaux de mémoire maximale |
2 |
2 |
Bande passante de mémoire maximale |
33.3 GB/s |
34.1 GB/s |
Taille de mémore maximale |
16 GB |
32 GB |
Genres de mémoire soutenus |
LPDDR3-1866, DDR3L-1600 |
DDR4-2133, LPDDR3-1866, DDR3L-1600 |
Device ID |
0x591C |
0x1927 |
Unités d’éxécution |
24 |
|
Graphics base frequency |
300 MHz |
300 MHz |
Graphics max dynamic frequency |
1.00 GHz |
1.00 GHz |
Technologie Intel® Clear Video HD |
|
|
Technologie Intel® Clear Video |
|
|
Intel® Quick Sync Video |
|
|
Mémoire de vidéo maximale |
16 GB |
32 GB |
Graphiques du processeur |
Intel UHD Graphics 615 |
Intel® Iris® Graphics 550 |
eDRAM |
|
64 MB |
Freéquency maximale des graphiques |
|
1 GHz |
Technologie Intel® InTru™ 3D |
|
|
DisplayPort |
|
|
DVI |
|
|
eDP |
|
|
HDMI |
|
|
Nombre d’écrans soutenu |
3 |
3 |
Soutien du Wireless Display (WiDi) |
|
|
Soutien de la resolution 4K |
|
|
Résolution maximale sur DisplayPort |
3840x2160@60Hz |
4096x2304@60Hz |
Résolution maximale sur eDP |
3840x2160@60Hz |
4096x2304@60Hz |
Résolution maximale sur HDMI 1.4 |
|
4096x2304@24Hz |
Résolution maximale sur VGA |
|
N / A |
Résolution maximale sur WiDi |
|
1080p |
DirectX |
12 |
12 |
OpenGL |
4.5 |
4.5 |
Configurable TDP-down |
3.5 Watt |
23 W |
Configurable TDP-down Frequency |
600 MHz |
|
Configurable TDP-up |
7 Watt |
|
Configurable TDP-up Frequency |
1.60 GHz |
|
Nombre de CPUs maximale dans une configuration |
1 |
1 |
Package Size |
20mm X 16.5mm |
42mm X 24mm |
Thermal Design Power (TDP) |
5 Watt |
28 Watt |
Low Halogen Options Available |
|
|
Prise courants soutenu |
|
FCBGA1356 |
Nombre maximale des voies PCIe |
10 |
12 |
Révision PCI Express |
3.0 |
3.0 |
PCIe configurations |
1x4, 2x2, 1x2+2x1 and 4x1 |
1x4, 2x2, 1x2+2x1 and 4x1 |
Execute Disable Bit (EDB) |
|
|
Technologie Intel® Identity Protection |
|
|
Intel® Memory Protection Extensions (Intel® MPX) |
|
|
Intel® OS Guard |
|
|
Technologie Intel® Secure Key |
|
|
Technologie Intel® Trusted Execution (TXT) |
|
|
Intel® Software Guard Extensions (Intel® SGX) |
|
|
Technologie Enhanced Intel SpeedStep® |
|
|
Idle States |
|
|
Extensions de l’ensemble d’instructions |
Intel SSE4.1, Intel SSE4.2, Intel AVX2 |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 |
|
|
Intel® AES New Instructions |
|
|
Intel® Flex Memory Access |
|
|
Technologie Intel® Hyper-Threading |
|
|
Intel® Stable Image Platform Program (SIPP) |
|
|
Technologie Intel® Turbo Boost |
|
|
Speed Shift technology |
|
|
Thermal Monitoring |
|
|
Intel® Advanced Vector Extensions (AVX) |
|
|
Technologie Intel® My WiFi |
|
|
Technologie Intel® Smart Response |
|
|
Intel® TSX-NI |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|
AMD Virtualization (AMD-V™) |
|
|