AMD Opteron X2 875 HE vs Intel Pentium 4 HT 661

Comparative analysis of AMD Opteron X2 875 HE and Intel Pentium 4 HT 661 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Memory, Security & Reliability, Advanced Technologies, Virtualization.

 

Differences

Reasons to consider the AMD Opteron X2 875 HE

  • CPU is newer: launch date 1 month(s) later
  • 1 more cores, run more applications at once: 2 vs 1
  • 4.6x more L1 cache, more data can be stored in the L1 cache for quick access later
  • Around 56% lower typical power consumption: 55 Watt vs 86 Watt
Launch date February 2006 vs January 2006
Number of cores 2 vs 1
L1 cache 128 KB vs 28 KB
Max number of CPUs in a configuration 8 vs 1
Thermal Design Power (TDP) 55 Watt vs 86 Watt

Reasons to consider the Intel Pentium 4 HT 661

  • Around 64% higher clock speed: 3.6 GHz vs 2.2 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
Maximum frequency 3.6 GHz vs 2.2 GHz
Manufacturing process technology 65 nm vs 90 nm
L2 cache 2048 KB vs 1024 KB

Compare specifications (specs)

AMD Opteron X2 875 HE Intel Pentium 4 HT 661

Essentials

Architecture codename Egypt Cedarmill
Launch date February 2006 January 2006
Place in performance rating not rated not rated
Vertical segment Server Desktop
Processor Number 661
Series Legacy Intel® Pentium® Processor
Status Discontinued

Performance

64 bit support
L1 cache 128 KB 28 KB
L2 cache 1024 KB 2048 KB
Manufacturing process technology 90 nm 65 nm
Maximum frequency 2.2 GHz 3.6 GHz
Number of cores 2 1
Transistor count 233 million 188 million
Base frequency 3.60 GHz
Bus Speed 800 MHz FSB
Die size 81 mm2
Maximum core temperature B1+C1=69°C, D0=64.4°C
VID voltage range 1.200V-1.3375V

Compatibility

Max number of CPUs in a configuration 8 1
Sockets supported 940 PLGA775
Thermal Design Power (TDP) 55 Watt 86 Watt
Low Halogen Options Available
Package Size 37.5mm x 37.5mm
Scenario Design Power (SDP) 0 W

Memory

Supported memory types DDR1, DDR2, DDR3

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE) 32-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)