AMD Opteron X2 875 HE vs Intel Pentium 4 HT 661
Comparative analysis of AMD Opteron X2 875 HE and Intel Pentium 4 HT 661 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Memory, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the AMD Opteron X2 875 HE
- CPU is newer: launch date 1 month(s) later
- 1 more cores, run more applications at once: 2 vs 1
- 4.6x more L1 cache, more data can be stored in the L1 cache for quick access later
- Around 56% lower typical power consumption: 55 Watt vs 86 Watt
Launch date | February 2006 vs January 2006 |
Number of cores | 2 vs 1 |
L1 cache | 128 KB vs 28 KB |
Max number of CPUs in a configuration | 8 vs 1 |
Thermal Design Power (TDP) | 55 Watt vs 86 Watt |
Reasons to consider the Intel Pentium 4 HT 661
- Around 64% higher clock speed: 3.6 GHz vs 2.2 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
Maximum frequency | 3.6 GHz vs 2.2 GHz |
Manufacturing process technology | 65 nm vs 90 nm |
L2 cache | 2048 KB vs 1024 KB |
Compare specifications (specs)
AMD Opteron X2 875 HE | Intel Pentium 4 HT 661 | |
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Essentials |
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Architecture codename | Egypt | Cedarmill |
Launch date | February 2006 | January 2006 |
Place in performance rating | not rated | not rated |
Vertical segment | Server | Desktop |
Processor Number | 661 | |
Series | Legacy Intel® Pentium® Processor | |
Status | Discontinued | |
Performance |
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64 bit support | ||
L1 cache | 128 KB | 28 KB |
L2 cache | 1024 KB | 2048 KB |
Manufacturing process technology | 90 nm | 65 nm |
Maximum frequency | 2.2 GHz | 3.6 GHz |
Number of cores | 2 | 1 |
Transistor count | 233 million | 188 million |
Base frequency | 3.60 GHz | |
Bus Speed | 800 MHz FSB | |
Die size | 81 mm2 | |
Maximum core temperature | B1+C1=69°C, D0=64.4°C | |
VID voltage range | 1.200V-1.3375V | |
Compatibility |
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Max number of CPUs in a configuration | 8 | 1 |
Sockets supported | 940 | PLGA775 |
Thermal Design Power (TDP) | 55 Watt | 86 Watt |
Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm | |
Scenario Design Power (SDP) | 0 W | |
Memory |
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Supported memory types | DDR1, DDR2, DDR3 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 32-bit | |
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) |