AMD Ryzen 9 3900 vs Intel Core i3-2100T
Comparative analysis of AMD Ryzen 9 3900 and Intel Core i3-2100T processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization, Graphics, Graphics interfaces, Security & Reliability. Benchmark processor performance analysis: CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD Ryzen 9 3900
- CPU is newer: launch date 8 year(s) 7 month(s) later
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- 10 more cores, run more applications at once: 12 vs 2
- 20 more threads: 24 vs 4
- Around 171900% higher clock speed: 4300 MHz vs 2.5 GHz
- Around 46% higher maximum core temperature: 95 °C vs 65.0°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 32 nm
- 6x more L1 cache, more data can be stored in the L1 cache for quick access later
- 12x more L2 cache, more data can be stored in the L2 cache for quick access later
- 21.3x more L3 cache, more data can be stored in the L3 cache for quick access later
- 4x more maximum memory size: 128 GB vs 32 GB
Launch date | 24 Sep 2019 vs February 2011 |
Unlocked | Unlocked vs Locked |
Number of cores | 12 vs 2 |
Number of threads | 24 vs 4 |
Maximum frequency | 4300 MHz vs 2.5 GHz |
Maximum core temperature | 95 °C vs 65.0°C |
Manufacturing process technology | 7 nm vs 32 nm |
L1 cache | 768 KB vs 64 KB (per core) |
L2 cache | 6 MB vs 256 KB (per core) |
L3 cache | 64 MB vs 3072 KB (shared) |
Maximum memory size | 128 GB vs 32 GB |
Reasons to consider the Intel Core i3-2100T
- Around 86% lower typical power consumption: 35 Watt vs 65 Watt
Thermal Design Power (TDP) | 35 Watt vs 65 Watt |
Compare benchmarks
CPU 1: AMD Ryzen 9 3900
CPU 2: Intel Core i3-2100T
Name | AMD Ryzen 9 3900 | Intel Core i3-2100T |
---|---|---|
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 30.97 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 70.972 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 1.748 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 4.924 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 19.043 | |
PassMark - Single thread mark | 1088 | |
PassMark - CPU mark | 1488 | |
Geekbench 4 - Single Core | 2356 | |
Geekbench 4 - Multi-Core | 4444 |
Compare specifications (specs)
AMD Ryzen 9 3900 | Intel Core i3-2100T | |
---|---|---|
Essentials |
||
Architecture codename | Zen 2 | Sandy Bridge |
Launch date | 24 Sep 2019 | February 2011 |
OPN Tray | 100-000000070 | |
Place in performance rating | 1373 | 1347 |
Vertical segment | Desktop | Desktop |
Launch price (MSRP) | $180 | |
Price now | $59.99 | |
Processor Number | i3-2100T | |
Series | Legacy Intel® Core™ Processors | |
Status | Discontinued | |
Value for money (0-100) | 14.40 | |
Performance |
||
64 bit support | ||
Base frequency | 3100 MHz | 2.50 GHz |
L1 cache | 768 KB | 64 KB (per core) |
L2 cache | 6 MB | 256 KB (per core) |
L3 cache | 64 MB | 3072 KB (shared) |
Manufacturing process technology | 7 nm | 32 nm |
Maximum core temperature | 95 °C | 65.0°C |
Maximum frequency | 4300 MHz | 2.5 GHz |
Number of cores | 12 | 2 |
Number of threads | 24 | 4 |
Unlocked | ||
Bus Speed | 5 GT/s DMI | |
Die size | 131 mm | |
Transistor count | 504 million | |
Memory |
||
Max memory channels | 2 | 2 |
Maximum memory bandwidth | 47.68 GB/s | 21 GB/s |
Maximum memory size | 128 GB | 32 GB |
Supported memory types | DDR4-3200 | DDR3 1066/1333 |
Compatibility |
||
Sockets supported | AM4 | FCLGA1155 |
Thermal Design Power (TDP) | 65 Watt | 35 Watt |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 37.5mm x 37.5mm | |
Peripherals |
||
Max number of PCIe lanes | 20 | 16 |
PCI Express revision | 4.0 | 2.0 |
PCIe configurations | 1x16+x4, 2x8+x4, 1x8+2x4+x4 | |
Advanced Technologies |
||
Enhanced Virus Protection (EVP) | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
||
AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics |
||
Device ID | 0x102 | |
Graphics base frequency | 650 MHz | |
Graphics max dynamic frequency | 1.10 GHz | |
Graphics max frequency | 1.1 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel® HD Graphics 2000 | |
Graphics interfaces |
||
Number of displays supported | 2 | |
Wireless Display (WiDi) support | ||
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Trusted Execution technology (TXT) |