AMD Ryzen 9 6900HS vs Intel Core i7-4760HQ
Comparative analysis of AMD Ryzen 9 6900HS and Intel Core i7-4760HQ processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals, Advanced Technologies, Virtualization, Graphics interfaces, Graphics image quality, Graphics API support, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD Ryzen 9 6900HS
- CPU is newer: launch date 7 year(s) 8 month(s) later
- 4 more cores, run more applications at once: 8 vs 4
- 8 more threads: 16 vs 8
- Around 48% higher clock speed: 4.9 GHz vs 3.30 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 6 nm vs 22 nm
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2.7x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 34% lower typical power consumption: 35 Watt vs 47 Watt
- Around 69% better performance in PassMark - Single thread mark: 3286 vs 1944
- 3.7x better performance in PassMark - CPU mark: 23566 vs 6300
Specifications (specs) | |
Launch date | Jan 2022 vs 14 April 2014 |
Number of cores | 8 vs 4 |
Number of threads | 16 vs 8 |
Maximum frequency | 4.9 GHz vs 3.30 GHz |
Manufacturing process technology | 6 nm vs 22 nm |
L1 cache | 512 KB vs 256 KB |
L2 cache | 4 MB vs 1 MB |
L3 cache | 16 MB vs 6 MB |
Thermal Design Power (TDP) | 35 Watt vs 47 Watt |
Benchmarks | |
PassMark - Single thread mark | 3286 vs 1944 |
PassMark - CPU mark | 23566 vs 6300 |
Reasons to consider the Intel Core i7-4760HQ
- Around 5% higher maximum core temperature: 100°C vs 95 °C
Maximum core temperature | 100°C vs 95 °C |
Compare benchmarks
CPU 1: AMD Ryzen 9 6900HS
CPU 2: Intel Core i7-4760HQ
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen 9 6900HS | Intel Core i7-4760HQ |
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PassMark - Single thread mark | 3286 | 1944 |
PassMark - CPU mark | 23566 | 6300 |
3DMark Fire Strike - Physics Score | 6900 | |
Geekbench 4 - Single Core | 3659 | |
Geekbench 4 - Multi-Core | 12124 |
Compare specifications (specs)
AMD Ryzen 9 6900HS | Intel Core i7-4760HQ | |
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Essentials |
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Architecture codename | Zen 3+ | Crystal Well |
Launch date | Jan 2022 | 14 April 2014 |
Place in performance rating | 608 | 613 |
Vertical segment | Mobile | Mobile |
Launch price (MSRP) | $434 | |
Processor Number | i7-4760HQ | |
Series | 4th Generation Intel® Core™ i7 Processors | |
Status | Launched | |
Performance |
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Base frequency | 3.3 GHz | 2.10 GHz |
Die size | 208 mm² | 260 mm |
L1 cache | 512 KB | 256 KB |
L2 cache | 4 MB | 1 MB |
L3 cache | 16 MB | 6 MB |
Manufacturing process technology | 6 nm | 22 nm |
Maximum core temperature | 95 °C | 100°C |
Maximum frequency | 4.9 GHz | 3.30 GHz |
Number of cores | 8 | 4 |
Number of threads | 16 | 8 |
Unlocked | ||
64 bit support | ||
Bus Speed | 5 GT/s DMI2 | |
Maximum case temperature (TCase) | 100 °C | |
Transistor count | 1700 Million | |
Memory |
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ECC memory support | ||
Max memory channels | 2 | 2 |
Supported memory types | DDR5-4800 | DDR3L 1333/1600 |
Maximum memory bandwidth | 25.6 GB/s | |
Maximum memory size | 32 GB | |
Graphics |
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Graphics max frequency | 2400 MHz | 1.2 GHz |
Device ID | 0xD26 | |
Graphics base frequency | 200 MHz | |
Graphics max dynamic frequency | 1.20 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 2 GB | |
Processor graphics | Intel® Iris® Pro Graphics 5200 | |
Compatibility |
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Sockets supported | FP7 | FCBGA1364 |
Thermal Design Power (TDP) | 35 Watt | 47 Watt |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 37.5mm x 32mm x 1.6mm | |
Peripherals |
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Max number of PCIe lanes | 20 | 16 |
PCI Express revision | 4.0 | 3 |
PCIe configurations | 1x16, 2x8, 1x8 2x4 | |
Advanced Technologies |
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AMD SenseMI | ||
AMD StoreMI technology | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Intel® AES New Instructions | ||
Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
Intel 64 | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics interfaces |
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DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
VGA | ||
Wireless Display (WiDi) support | ||
Graphics image quality |
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Max resolution over DisplayPort | 3840x2160@60Hz | |
Max resolution over HDMI 1.4 | 3840x2160@60Hz | |
Max resolution over VGA | 2880x1800@60Hz | |
Graphics API support |
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DirectX | 11.2/12 | |
OpenGL | 4.3 | |
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) |