AMD Ryzen 9 7940HS vs AMD EPYC Embedded 9124

Comparative analysis of AMD Ryzen 9 7940HS and AMD EPYC Embedded 9124 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.

AMD Ryzen 9 7940HS

AMD EPYC Embedded 9124

Differences

Reasons to consider the AMD Ryzen 9 7940HS

Around 41% higher clock speed: 5.2 GHz vs 3.7 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 4 nm vs 5 nm
5.7x lower typical power consumption: 35 Watt vs 200 Watt

Maximum frequency	5.2 GHz vs 3.7 GHz
Manufacturing process technology	4 nm vs 5 nm
Thermal Design Power (TDP)	35 Watt vs 200 Watt

Reasons to consider the AMD EPYC Embedded 9124

CPU is newer: launch date 2 month(s) later
8 more cores, run more applications at once: 16 vs 8
16 more threads: 32 vs 16
2x more L1 cache, more data can be stored in the L1 cache for quick access later
2x more L2 cache, more data can be stored in the L2 cache for quick access later
4x more L3 cache, more data can be stored in the L3 cache for quick access later

Launch date	14 Mar 2023 vs Jan 2023
Number of cores	16 vs 8
Number of threads	32 vs 16
L1 cache	64K (per core) vs 64K (per core)
L2 cache	1MB (per core) vs 1MB (per core)
L3 cache	64MB (shared) vs 16MB (shared)
Max number of CPUs in a configuration	2 vs 1

Compare benchmarks

CPU 1: AMD Ryzen 9 7940HS
CPU 2: AMD EPYC Embedded 9124

Name	AMD Ryzen 9 7940HS	AMD EPYC Embedded 9124
PassMark - Single thread mark	3904
PassMark - CPU mark	30391
3DMark Fire Strike - Physics Score	7717

Compare specifications (specs)

	AMD Ryzen 9 7940HS	AMD EPYC Embedded 9124
Essentials
Launch date	Jan 2023	14 Mar 2023
Place in performance rating	340	not rated
Performance
Base frequency	4 GHz	3 GHz
Die size	178 mm²	4x 72 mm²
L1 cache	64K (per core)	64K (per core)
L2 cache	1MB (per core)	1MB (per core)
L3 cache	16MB (shared)	64MB (shared)
Manufacturing process technology	4 nm	5 nm
Maximum core temperature	100°C
Maximum frequency	5.2 GHz	3.7 GHz
Number of cores	8	16
Number of threads	16	32
Transistor count	25,000 million	26,280 million
Unlocked
Memory
ECC memory support
Supported memory types	DDR5-5600 MHz, Dual-channel	DDR5-4800 MHz, Twelve-channel
Compatibility
Configurable TDP	54 Watt	200-240 Watt
Max number of CPUs in a configuration	1	2
Sockets supported	FP8	SP5
Thermal Design Power (TDP)	35 Watt	200 Watt
Peripherals
PCIe configurations	Gen 4, 20 Lanes, (CPU only)	Gen 5, 128 Lanes, (CPU only)