AMD Ryzen 9 7940HS vs Intel Xeon X5570
Comparative analysis of AMD Ryzen 9 7940HS and Intel Xeon X5570 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the AMD Ryzen 9 7940HS
- CPU is newer: launch date 13 year(s) 10 month(s) later
- 4 more cores, run more applications at once: 8 vs 4
- 8 more threads: 16 vs 8
- Around 56% higher clock speed: 5.2 GHz vs 3.33 GHz
- Around 33% higher maximum core temperature: 100°C vs 75°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 4 nm vs 45 nm
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2.7x lower typical power consumption: 35 Watt vs 95 Watt
- 2.7x better performance in PassMark - Single thread mark: 3882 vs 1445
- 4.8x better performance in PassMark - CPU mark: 30156 vs 6253
Specifications (specs) | |
Launch date | Jan 2023 vs March 2009 |
Number of cores | 8 vs 4 |
Number of threads | 16 vs 8 |
Maximum frequency | 5.2 GHz vs 3.33 GHz |
Maximum core temperature | 100°C vs 75°C |
Manufacturing process technology | 4 nm vs 45 nm |
L1 cache | 64K (per core) vs 64 KB (per core) |
Thermal Design Power (TDP) | 35 Watt vs 95 Watt |
Benchmarks | |
PassMark - Single thread mark | 3882 vs 1445 |
PassMark - CPU mark | 30156 vs 6253 |
Reasons to consider the Intel Xeon X5570
- 131072x more L2 cache, more data can be stored in the L2 cache for quick access later
- 524288x more L3 cache, more data can be stored in the L3 cache for quick access later
L2 cache | 256 KB (per core) vs 1MB (per core) |
L3 cache | 8192 KB (shared) vs 16MB (shared) |
Max number of CPUs in a configuration | 2 vs 1 |
Compare benchmarks
CPU 1: AMD Ryzen 9 7940HS
CPU 2: Intel Xeon X5570
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen 9 7940HS | Intel Xeon X5570 |
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PassMark - Single thread mark | 3882 | 1445 |
PassMark - CPU mark | 30156 | 6253 |
3DMark Fire Strike - Physics Score | 7677 | |
Geekbench 4 - Single Core | 556 | |
Geekbench 4 - Multi-Core | 2426 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 1.916 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 70.849 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.546 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 3.071 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 9.269 |
Compare specifications (specs)
AMD Ryzen 9 7940HS | Intel Xeon X5570 | |
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Essentials |
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Launch date | Jan 2023 | March 2009 |
Place in performance rating | 335 | 2463 |
Architecture codename | Nehalem EP | |
Launch price (MSRP) | $49 | |
Price now | $89 | |
Processor Number | X5570 | |
Series | Legacy Intel® Xeon® Processors | |
Status | Launched | |
Value for money (0-100) | 18.79 | |
Vertical segment | Server | |
Performance |
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Base frequency | 4 GHz | 2.93 GHz |
Die size | 178 mm² | 263 mm2 |
L1 cache | 64K (per core) | 64 KB (per core) |
L2 cache | 1MB (per core) | 256 KB (per core) |
L3 cache | 16MB (shared) | 8192 KB (shared) |
Manufacturing process technology | 4 nm | 45 nm |
Maximum core temperature | 100°C | 75°C |
Maximum frequency | 5.2 GHz | 3.33 GHz |
Number of cores | 8 | 4 |
Number of threads | 16 | 8 |
Transistor count | 25,000 million | 731 million |
Unlocked | ||
64 bit support | ||
Bus Speed | 6.4 GT/s QPI | |
Number of QPI Links | 2 | |
VID voltage range | 0.75V -1.35V | |
Memory |
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ECC memory support | ||
Supported memory types | DDR5-5600 MHz, Dual-channel | DDR3 800/1066/1333 |
Max memory channels | 3 | |
Maximum memory bandwidth | 32 GB/s | |
Maximum memory size | 144 GB | |
Compatibility |
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Configurable TDP | 54 Watt | |
Max number of CPUs in a configuration | 1 | 2 |
Sockets supported | FP8 | FCLGA1366 |
Thermal Design Power (TDP) | 35 Watt | 95 Watt |
Low Halogen Options Available | ||
Package Size | 42.5mm x 45mm | |
Peripherals |
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PCIe configurations | Gen 4, 20 Lanes, (CPU only) | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 40-bit | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |