AMD Ryzen 9 7940HS vs Intel Xeon X5570

Comparative analysis of AMD Ryzen 9 7940HS and Intel Xeon X5570 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

 

Differences

Reasons to consider the AMD Ryzen 9 7940HS

  • CPU is newer: launch date 13 year(s) 10 month(s) later
  • 4 more cores, run more applications at once: 8 vs 4
  • 8 more threads: 16 vs 8
  • Around 56% higher clock speed: 5.2 GHz vs 3.33 GHz
  • Around 33% higher maximum core temperature: 100°C vs 75°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 4 nm vs 45 nm
  • 2x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 2.7x lower typical power consumption: 35 Watt vs 95 Watt
  • 2.7x better performance in PassMark - Single thread mark: 3882 vs 1445
  • 4.8x better performance in PassMark - CPU mark: 30156 vs 6253
Specifications (specs)
Launch date Jan 2023 vs March 2009
Number of cores 8 vs 4
Number of threads 16 vs 8
Maximum frequency 5.2 GHz vs 3.33 GHz
Maximum core temperature 100°C vs 75°C
Manufacturing process technology 4 nm vs 45 nm
L1 cache 64K (per core) vs 64 KB (per core)
Thermal Design Power (TDP) 35 Watt vs 95 Watt
Benchmarks
PassMark - Single thread mark 3882 vs 1445
PassMark - CPU mark 30156 vs 6253

Reasons to consider the Intel Xeon X5570

  • 131072x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 524288x more L3 cache, more data can be stored in the L3 cache for quick access later
L2 cache 256 KB (per core) vs 1MB (per core)
L3 cache 8192 KB (shared) vs 16MB (shared)
Max number of CPUs in a configuration 2 vs 1

Compare benchmarks

CPU 1: AMD Ryzen 9 7940HS
CPU 2: Intel Xeon X5570

PassMark - Single thread mark
CPU 1
CPU 2
3882
1445
PassMark - CPU mark
CPU 1
CPU 2
30156
6253
Name AMD Ryzen 9 7940HS Intel Xeon X5570
PassMark - Single thread mark 3882 1445
PassMark - CPU mark 30156 6253
3DMark Fire Strike - Physics Score 7677
Geekbench 4 - Single Core 556
Geekbench 4 - Multi-Core 2426
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 1.916
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 70.849
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.546
CompuBench 1.5 Desktop - Video Composition (Frames/s) 3.071
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 9.269

Compare specifications (specs)

AMD Ryzen 9 7940HS Intel Xeon X5570

Essentials

Launch date Jan 2023 March 2009
Place in performance rating 335 2463
Architecture codename Nehalem EP
Launch price (MSRP) $49
Price now $89
Processor Number X5570
Series Legacy Intel® Xeon® Processors
Status Launched
Value for money (0-100) 18.79
Vertical segment Server

Performance

Base frequency 4 GHz 2.93 GHz
Die size 178 mm² 263 mm2
L1 cache 64K (per core) 64 KB (per core)
L2 cache 1MB (per core) 256 KB (per core)
L3 cache 16MB (shared) 8192 KB (shared)
Manufacturing process technology 4 nm 45 nm
Maximum core temperature 100°C 75°C
Maximum frequency 5.2 GHz 3.33 GHz
Number of cores 8 4
Number of threads 16 8
Transistor count 25,000 million 731 million
Unlocked
64 bit support
Bus Speed 6.4 GT/s QPI
Number of QPI Links 2
VID voltage range 0.75V -1.35V

Memory

ECC memory support
Supported memory types DDR5-5600 MHz, Dual-channel DDR3 800/1066/1333
Max memory channels 3
Maximum memory bandwidth 32 GB/s
Maximum memory size 144 GB

Compatibility

Configurable TDP 54 Watt
Max number of CPUs in a configuration 1 2
Sockets supported FP8 FCLGA1366
Thermal Design Power (TDP) 35 Watt 95 Watt
Low Halogen Options Available
Package Size 42.5mm x 45mm

Peripherals

PCIe configurations Gen 4, 20 Lanes, (CPU only)

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE) 40-bit

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)