AMD Ryzen Embedded R1600 vs Intel Core i7-4770HQ
Comparative analysis of AMD Ryzen Embedded R1600 and Intel Core i7-4770HQ processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the AMD Ryzen Embedded R1600
- CPU is newer: launch date 5 year(s) 7 month(s) later
- Around 5% higher maximum core temperature: 105 °C vs 100 °C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
- 3.1x lower typical power consumption: 15 Watt vs 47 Watt
Launch date | 25 Feb 2020 vs 21 July 2014 |
Maximum core temperature | 105 °C vs 100 °C |
Manufacturing process technology | 14 nm vs 22 nm |
Thermal Design Power (TDP) | 15 Watt vs 47 Watt |
Reasons to consider the Intel Core i7-4770HQ
- 2 more cores, run more applications at once: 4 vs 2
- 4 more threads: 8 vs 4
- Around 10% higher clock speed: 3.40 GHz vs 3.1 GHz
- Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 50% more L3 cache; more data can be stored in the L3 cache for quick access later
- Around 7% better performance in PassMark - Single thread mark: 1912 vs 1779
- Around 80% better performance in PassMark - CPU mark: 6058 vs 3365
Specifications (specs) | |
Number of cores | 4 vs 2 |
Number of threads | 8 vs 4 |
Maximum frequency | 3.40 GHz vs 3.1 GHz |
L1 cache | 256 KB vs 192 KB |
L3 cache | 6 MB vs 4 MB |
Benchmarks | |
PassMark - Single thread mark | 1912 vs 1779 |
PassMark - CPU mark | 6058 vs 3365 |
Compare benchmarks
CPU 1: AMD Ryzen Embedded R1600
CPU 2: Intel Core i7-4770HQ
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen Embedded R1600 | Intel Core i7-4770HQ |
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PassMark - Single thread mark | 1779 | 1912 |
PassMark - CPU mark | 3365 | 6058 |
Geekbench 4 - Single Core | 767 | |
Geekbench 4 - Multi-Core | 2981 | |
GFXBench 4.0 - Car Chase Offscreen (Frames) | 1960 | |
GFXBench 4.0 - Manhattan (Frames) | 1658 | |
GFXBench 4.0 - T-Rex (Frames) | 3060 | |
GFXBench 4.0 - Car Chase Offscreen (Fps) | 1960 | |
GFXBench 4.0 - Manhattan (Fps) | 1658 | |
GFXBench 4.0 - T-Rex (Fps) | 3060 |
Compare specifications (specs)
AMD Ryzen Embedded R1600 | Intel Core i7-4770HQ | |
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Essentials |
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Architecture codename | Zen | Crystal Well |
Launch date | 25 Feb 2020 | 21 July 2014 |
Place in performance rating | 1460 | 1389 |
Vertical segment | Mobile | Mobile |
Launch price (MSRP) | $434 | |
Processor Number | i7-4770HQ | |
Series | 4th Generation Intel® Core™ i7 Processors | |
Status | Launched | |
Performance |
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Base frequency | 2.6 GHz | 2.20 GHz |
Die size | 209.8 mm² | 260 mm |
L1 cache | 192 KB | 256 KB |
L2 cache | 1 MB | 1 MB |
L3 cache | 4 MB | 6 MB |
Manufacturing process technology | 14 nm | 22 nm |
Maximum core temperature | 105 °C | 100 °C |
Maximum frequency | 3.1 GHz | 3.40 GHz |
Number of cores | 2 | 4 |
Number of threads | 4 | 8 |
Transistor count | 4950 million | 1700 Million |
Unlocked | ||
64 bit support | ||
Bus Speed | 5 GT/s DMI2 | |
Maximum case temperature (TCase) | 100 °C | |
Memory |
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ECC memory support | ||
Max memory channels | 2 | 2 |
Supported memory types | DDR4-2400 | DDR3L 1333/1600 |
Maximum memory bandwidth | 25.6 GB/s | |
Maximum memory size | 32 GB | |
Compatibility |
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Configurable TDP-down | 12 Watt | |
Configurable TDP-up | 25 Watt | |
Max number of CPUs in a configuration | 1 | 1 |
Socket Count | FP5 | |
Thermal Design Power (TDP) | 15 Watt | 47 Watt |
Low Halogen Options Available | ||
Package Size | 37.5mm x 32mm x 1.65mm | |
Sockets supported | FCBGA1364 | |
Peripherals |
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Max number of PCIe lanes | 8 | 16 |
PCI Express revision | 3.0 | 3 |
PCIe configurations | 1x16 or 2x8 or 1x8 2x4 | |
Graphics |
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Device ID | 0xD26 | |
Graphics base frequency | 200 MHz | |
Graphics max dynamic frequency | 1.20 GHz | |
Graphics max frequency | 1.2 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 2 GB | |
Processor graphics | Intel® Iris® Pro Graphics 5200 | |
Graphics interfaces |
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DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
VGA | ||
Wireless Display (WiDi) support | ||
Graphics image quality |
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Max resolution over DisplayPort | 3840x2160@60Hz | |
Max resolution over HDMI 1.4 | 3840x2160@60Hz | |
Max resolution over VGA | 2880x1800@60Hz | |
Graphics API support |
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DirectX | 11.2/12 | |
OpenGL | 4.3 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |