AMD Ryzen Embedded R1600 vs Intel Pentium D 840 EE

Comparative analysis of AMD Ryzen Embedded R1600 and Intel Pentium D 840 EE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Ryzen Embedded R1600

Intel Pentium D 840 EE

Differences

Reasons to consider the AMD Ryzen Embedded R1600

CPU is newer: launch date 14 year(s) 9 month(s) later
Around 50% higher maximum core temperature: 105 °C vs 69.8°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 90 nm
6.9x more L1 cache, more data can be stored in the L1 cache for quick access later
8.7x lower typical power consumption: 15 Watt vs 130 Watt

Launch date	25 Feb 2020 vs May 2005
Maximum core temperature	105 °C vs 69.8°C
Manufacturing process technology	14 nm vs 90 nm
L1 cache	192 KB vs 28 KB
Thermal Design Power (TDP)	15 Watt vs 130 Watt

Reasons to consider the Intel Pentium D 840 EE

Around 3% higher clock speed: 3.2 GHz vs 3.1 GHz
2x more L2 cache, more data can be stored in the L2 cache for quick access later

Maximum frequency	3.2 GHz vs 3.1 GHz
L2 cache	2048 KB vs 1 MB
Max number of CPUs in a configuration	2 vs 1

Compare benchmarks

CPU 1: AMD Ryzen Embedded R1600
CPU 2: Intel Pentium D 840 EE

Name	AMD Ryzen Embedded R1600	Intel Pentium D 840 EE
PassMark - Single thread mark	1724
PassMark - CPU mark	3276

Compare specifications (specs)

	AMD Ryzen Embedded R1600	Intel Pentium D 840 EE
Essentials
Architecture codename	Zen	Smithfield
Launch date	25 Feb 2020	May 2005
Place in performance rating	1498	not rated
Vertical segment	Mobile	Desktop
Processor Number		840
Series		Legacy Intel® Pentium® Processor
Status		Discontinued
Performance
Base frequency	2.6 GHz	3.20 GHz
Die size	209.8 mm²	206 mm2
L1 cache	192 KB	28 KB
L2 cache	1 MB	2048 KB
L3 cache	4 MB
Manufacturing process technology	14 nm	90 nm
Maximum core temperature	105 °C	69.8°C
Maximum frequency	3.1 GHz	3.2 GHz
Number of cores	2	2
Number of threads	4
Transistor count	4950 million	230 million
Unlocked
64 bit support
Bus Speed		800 MHz FSB
VID voltage range		1.200-1.400V
Memory
ECC memory support
Max memory channels	2
Supported memory types	DDR4-2400	DDR1, DDR2, DDR3
Compatibility
Configurable TDP-down	12 Watt
Configurable TDP-up	25 Watt
Max number of CPUs in a configuration	1	2
Socket Count	FP5
Thermal Design Power (TDP)	15 Watt	130 Watt
Low Halogen Options Available
Package Size		37.5mm x 37.5mm
Sockets supported		PLGA775
Peripherals
Max number of PCIe lanes	8
PCI Express revision	3.0
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE)		32-bit
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)