Intel Atom Z670 vs Intel Celeron Dual-Core T1700
Comparative analysis of Intel Atom Z670 and Intel Celeron Dual-Core T1700 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Atom Z670
- CPU is newer: launch date 2 year(s) 3 month(s) later
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
- 11.7x lower typical power consumption: 3 Watt vs 35 Watt
Launch date | April 2011 vs 7 December 2008 |
Manufacturing process technology | 45 nm vs 65 nm |
Thermal Design Power (TDP) | 3 Watt vs 35 Watt |
Reasons to consider the Intel Celeron Dual-Core T1700
- 1 more cores, run more applications at once: 2 vs 1
- Around 22% higher clock speed: 1.83 GHz vs 1.5 GHz
- Around 11% higher maximum core temperature: 100°C vs 90
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- 6.7x better performance in PassMark - CPU mark: 1058 vs 158
Specifications (specs) | |
Number of cores | 2 vs 1 |
Maximum frequency | 1.83 GHz vs 1.5 GHz |
Maximum core temperature | 100°C vs 90 |
L2 cache | 1024 KB vs 512 KB (per core) |
Benchmarks | |
PassMark - CPU mark | 1058 vs 158 |
Compare benchmarks
CPU 1: Intel Atom Z670
CPU 2: Intel Celeron Dual-Core T1700
PassMark - CPU mark |
|
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Name | Intel Atom Z670 | Intel Celeron Dual-Core T1700 |
---|---|---|
PassMark - Single thread mark | 95 | 0 |
PassMark - CPU mark | 158 | 1058 |
Compare specifications (specs)
Intel Atom Z670 | Intel Celeron Dual-Core T1700 | |
---|---|---|
Essentials |
||
Architecture codename | Lincroft | Merom |
Launch date | April 2011 | 7 December 2008 |
Place in performance rating | 3315 | 3323 |
Processor Number | Z670 | T1700 |
Series | Legacy Intel Atom® Processors | Legacy Intel® Celeron® Processor |
Status | Discontinued | Discontinued |
Vertical segment | Mobile | Mobile |
Performance |
||
Base frequency | 1.50 GHz | 1.83 GHz |
Die size | 65 mm | 143 mm2 |
L1 cache | 64 KB (per core) | |
L2 cache | 512 KB (per core) | 1024 KB |
Manufacturing process technology | 45 nm | 65 nm |
Maximum core temperature | 90 | 100°C |
Maximum frequency | 1.5 GHz | 1.83 GHz |
Number of cores | 1 | 2 |
Number of threads | 2 | 2 |
Transistor count | 140 million | 291 million |
VID voltage range | 1.1125-1.5000V | 1.075V-1.175V |
64 bit support | ||
Bus Speed | 667 MHz FSB | |
Front-side bus (FSB) | 667 MHz | |
Memory |
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Max memory channels | 1 | |
Maximum memory size | 2.93 GB | |
Supported memory types | DDR2 800 | |
Graphics |
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Graphics base frequency | 400 MHz | |
Processor graphics | Integrated | |
Graphics interfaces |
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LVDS | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 13.8mmx13.8mm | 35mm x 35mm |
Sockets supported | T-PBGA518 | PPGA478 |
Thermal Design Power (TDP) | 3 Watt | 35 Watt |
Peripherals |
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PCI support | ||
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE2, Intel® SSE3, Intel® SSSE3 | |
Intel 64 | ||
Intel® Hyper-Threading technology | ||
Thermal Monitoring | ||
FSB parity | ||
Intel® Demand Based Switching | ||
Intel® Turbo Boost technology | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |