Intel Atom Z670 vs Intel Celeron Dual-Core T1700

Comparative analysis of Intel Atom Z670 and Intel Celeron Dual-Core T1700 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Atom Z670

Intel Celeron Dual-Core T1700

Differences

Reasons to consider the Intel Atom Z670

CPU is newer: launch date 2 year(s) 3 month(s) later
A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
11.7x lower typical power consumption: 3 Watt vs 35 Watt

Launch date	April 2011 vs 7 December 2008
Manufacturing process technology	45 nm vs 65 nm
Thermal Design Power (TDP)	3 Watt vs 35 Watt

Reasons to consider the Intel Celeron Dual-Core T1700

1 more cores, run more applications at once: 2 vs 1
Around 22% higher clock speed: 1.83 GHz vs 1.5 GHz
Around 11% higher maximum core temperature: 100°C vs 90
2x more L2 cache, more data can be stored in the L2 cache for quick access later
6.7x better performance in PassMark - CPU mark: 1058 vs 158

Specifications (specs)
Number of cores	2 vs 1
Maximum frequency	1.83 GHz vs 1.5 GHz
Maximum core temperature	100°C vs 90
L2 cache	1024 KB vs 512 KB (per core)
Benchmarks
PassMark - CPU mark	1058 vs 158

Compare benchmarks

CPU 1: Intel Atom Z670
CPU 2: Intel Celeron Dual-Core T1700

PassMark - CPU mark

CPU 1

CPU 2

158

1058

Name	Intel Atom Z670	Intel Celeron Dual-Core T1700
PassMark - Single thread mark	95	0
PassMark - CPU mark	158	1058

Compare specifications (specs)

	Intel Atom Z670	Intel Celeron Dual-Core T1700
Essentials
Architecture codename	Lincroft	Merom
Launch date	April 2011	7 December 2008
Place in performance rating	3324	3332
Processor Number	Z670	T1700
Series	Legacy Intel Atom® Processors	Legacy Intel® Celeron® Processor
Status	Discontinued	Discontinued
Vertical segment	Mobile	Mobile
Performance
Base frequency	1.50 GHz	1.83 GHz
Die size	65 mm	143 mm2
L1 cache	64 KB (per core)
L2 cache	512 KB (per core)	1024 KB
Manufacturing process technology	45 nm	65 nm
Maximum core temperature	90	100°C
Maximum frequency	1.5 GHz	1.83 GHz
Number of cores	1	2
Number of threads	2	2
Transistor count	140 million	291 million
VID voltage range	1.1125-1.5000V	1.075V-1.175V
64 bit support
Bus Speed		667 MHz FSB
Front-side bus (FSB)		667 MHz
Memory
Max memory channels	1
Maximum memory size	2.93 GB
Supported memory types	DDR2 800
Graphics
Graphics base frequency	400 MHz
Processor graphics	Integrated
Graphics interfaces
LVDS
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	13.8mmx13.8mm	35mm x 35mm
Sockets supported	T-PBGA518	PPGA478
Thermal Design Power (TDP)	3 Watt	35 Watt
Peripherals
PCI support
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE2, Intel® SSE3, Intel® SSSE3
Intel 64
Intel® Hyper-Threading technology
Thermal Monitoring
FSB parity
Intel® Demand Based Switching
Intel® Turbo Boost technology
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)