Intel Celeron 2002E vs Intel Celeron B810E

Comparative analysis of Intel Celeron 2002E and Intel Celeron B810E processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Celeron 2002E

Intel Celeron B810E

Differences

Reasons to consider the Intel Celeron 2002E

A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
Around 93% higher maximum memory size: 32 GB vs 16.6 GB
Around 40% lower typical power consumption: 25 Watt vs 35 Watt

Manufacturing process technology	22 nm vs 32 nm
Maximum memory size	32 GB vs 16.6 GB
Thermal Design Power (TDP)	25 Watt vs 35 Watt

Compare benchmarks

CPU 1: Intel Celeron 2002E
CPU 2: Intel Celeron B810E

Name	Intel Celeron 2002E	Intel Celeron B810E
PassMark - Single thread mark	871
PassMark - CPU mark	1091

Compare specifications (specs)

	Intel Celeron 2002E	Intel Celeron B810E
Essentials
Architecture codename	Haswell	Sandy Bridge
Launch date	Q1'14	Q2'11
Place in performance rating	2447	not rated
Processor Number	2002E	B810E
Series	Intel® Celeron® Processor 2000 Series	Legacy Intel® Celeron® Processor
Status	Launched	Launched
Vertical segment	Embedded	Embedded
Performance
64 bit support
Base frequency	1.50 GHz	1.60 GHz
Bus Speed	5 GT/s DMI2
Manufacturing process technology	22 nm	32 nm
Maximum core temperature	100°C	100
Number of cores	2	2
Number of threads	2	2
Memory
Max memory channels	2	2
Maximum memory bandwidth	25.6 GB/s	21.3 GB/s
Maximum memory size	32 GB	16.6 GB
Supported memory types	DDR3L 1333/1600	DDR3 1066/1333
Graphics
Graphics base frequency	400 MHz	650 MHz
Graphics max dynamic frequency	900 MHz	1.00 GHz
Intel® Flexible Display Interface (Intel® FDI)
Max video memory	1 GB
Processor graphics	Intel HD Graphics	Intel HD Graphics
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Graphics interfaces
DisplayPort
eDP
HDMI
Number of displays supported	3	2
VGA
CRT
SDVO
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	37.5mm x 32mm x 1.6mm	31mm x 24mm (FCBGA1023)
Sockets supported	FCBGA1364	FCBGA1023
Thermal Design Power (TDP)	25 Watt	35 Watt
Peripherals
Max number of PCIe lanes	16	16
PCI Express revision	3.0	2.0
PCIe configurations	1x16 or 2x8 or 1x8 2x4	1x16, 2x8, 1x8 2x4
Scalability	1S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Anti-Theft technology
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
4G WiMAX Wireless
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® My WiFi technology
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)