Intel Celeron 827E vs Intel Core Duo T2600

Comparative analysis of Intel Celeron 827E and Intel Core Duo T2600 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Celeron 827E

Intel Core Duo T2600

Differences

Reasons to consider the Intel Celeron 827E

A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
Around 82% lower typical power consumption: 17 Watt vs 31 Watt
Around 1% better performance in PassMark - Single thread mark: 674 vs 667

Specifications (specs)
Manufacturing process technology	32 nm vs 65 nm
Thermal Design Power (TDP)	17 Watt vs 31 Watt
Benchmarks
PassMark - Single thread mark	674 vs 667

Reasons to consider the Intel Core Duo T2600

1 more cores, run more applications at once: 2 vs 1
1 more threads: 2 vs 1
Around 24% better performance in PassMark - CPU mark: 460 vs 371

Specifications (specs)
Number of cores	2 vs 1
Number of threads	2 vs 1
Benchmarks
PassMark - CPU mark	460 vs 371

Compare benchmarks

CPU 1: Intel Celeron 827E
CPU 2: Intel Core Duo T2600

PassMark - Single thread mark

CPU 1

CPU 2

674

667

PassMark - CPU mark

CPU 1

CPU 2

371

460

Name	Intel Celeron 827E	Intel Core Duo T2600
PassMark - Single thread mark	674	667
PassMark - CPU mark	371	460

Compare specifications (specs)

	Intel Celeron 827E	Intel Core Duo T2600
Essentials
Architecture codename	Sandy Bridge	Yonah
Launch date	Q3'11	5 January 2006
Place in performance rating	2745	2757
Processor Number	827E	T2600
Series	Legacy Intel® Celeron® Processor	Legacy Intel® Core™ Processors
Status	Launched	Discontinued
Vertical segment	Embedded	Mobile
Launch price (MSRP)		$440
Performance
64 bit support
Base frequency	1.40 GHz	2.16 GHz
Manufacturing process technology	32 nm	65 nm
Maximum core temperature	100	100°C
Number of cores	1	2
Number of threads	1	2
Bus Speed		667 MHz FSB
Die size		90 mm2
Front-side bus (FSB)		667 MHz
L2 cache		2048 KB
Maximum frequency		2.16 GHz
Transistor count		151 million
VID voltage range		1.1625V - 1.30V
Memory
Max memory channels	2
Maximum memory bandwidth	21.3 GB/s
Maximum memory size	16.6 GB
Supported memory types	DDR3 1066/1333	DDR1
Graphics
Graphics base frequency	350 MHz
Graphics max dynamic frequency	800 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported	2
SDVO
Compatibility
Low Halogen Options Available
Package Size	31mm x 24mm (FCBGA1023)	35mm x 35mm
Sockets supported	FCBGA1023	PPGA478, PBGA479
Thermal Design Power (TDP)	17 Watt	31 Watt
Max number of CPUs in a configuration		1
Scenario Design Power (SDP)		0 W
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16, 2x8, 1x8 2x4
Security & Reliability
Anti-Theft technology
Intel® Trusted Execution technology (TXT)
Execute Disable Bit (EDB)
Advanced Technologies
4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
FSB parity
Physical Address Extensions (PAE)		32-bit
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)