Intel Celeron 827E vs Intel Pentium Dual Core T2410

Comparative analysis of Intel Celeron 827E and Intel Pentium Dual Core T2410 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Celeron 827E

Intel Pentium Dual Core T2410

Differences

Reasons to consider the Intel Celeron 827E

A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
2.1x lower typical power consumption: 17 Watt vs 35 Watt

Manufacturing process technology	32 nm vs 65 nm
Thermal Design Power (TDP)	17 Watt vs 35 Watt

Reasons to consider the Intel Pentium Dual Core T2410

1 more cores, run more applications at once: 2 vs 1
1 more threads: 2 vs 1
Around 6% better performance in PassMark - Single thread mark: 712 vs 674
Around 53% better performance in PassMark - CPU mark: 566 vs 371

Specifications (specs)
Number of cores	2 vs 1
Number of threads	2 vs 1
Benchmarks
PassMark - Single thread mark	712 vs 674
PassMark - CPU mark	566 vs 371

Compare benchmarks

CPU 1: Intel Celeron 827E
CPU 2: Intel Pentium Dual Core T2410

PassMark - Single thread mark

CPU 1

CPU 2

674

712

PassMark - CPU mark

CPU 1

CPU 2

371

566

Name	Intel Celeron 827E	Intel Pentium Dual Core T2410
PassMark - Single thread mark	674	712
PassMark - CPU mark	371	566

Compare specifications (specs)

	Intel Celeron 827E	Intel Pentium Dual Core T2410
Essentials
Architecture codename	Sandy Bridge	Merom
Launch date	Q3'11	1 September 2008
Place in performance rating	2746	2690
Processor Number	827E
Series	Legacy Intel® Celeron® Processor	Intel Pentium Dual Core
Status	Launched
Vertical segment	Embedded	Laptop
Performance
64 bit support
Base frequency	1.40 GHz
Manufacturing process technology	32 nm	65 nm
Maximum core temperature	100
Number of cores	1	2
Number of threads	1	2
Die size		111 mm
Front-side bus (FSB)		533 MHz
L2 cache		1024 KB
Maximum frequency		2 GHz
Memory
Max memory channels	2
Maximum memory bandwidth	21.3 GB/s
Maximum memory size	16.6 GB
Supported memory types	DDR3 1066/1333
Graphics
Graphics base frequency	350 MHz
Graphics max dynamic frequency	800 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported	2
SDVO
Compatibility
Low Halogen Options Available
Package Size	31mm x 24mm (FCBGA1023)
Sockets supported	FCBGA1023	P, 478Pin
Thermal Design Power (TDP)	17 Watt	35 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16, 2x8, 1x8 2x4
Security & Reliability
Anti-Theft technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)