Intel Celeron 877 vs Intel Core 2 Duo T5550

Comparative analysis of Intel Celeron 877 and Intel Core 2 Duo T5550 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Celeron 877

  • CPU is newer: launch date 3 year(s) 10 month(s) later
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
  • 2.1x lower typical power consumption: 17 Watt vs 35 Watt
  • Around 9% better performance in PassMark - CPU mark: 692 vs 637
  • Around 4% better performance in Geekbench 4 - Single Core: 252 vs 243
  • Around 9% better performance in Geekbench 4 - Multi-Core: 450 vs 411
Specifications (specs)
Launch date 1 December 2011 vs 1 January 2008
Manufacturing process technology 32 nm vs 65 nm
Thermal Design Power (TDP) 17 Watt vs 35 Watt
Benchmarks
PassMark - CPU mark 692 vs 637
Geekbench 4 - Single Core 252 vs 243
Geekbench 4 - Multi-Core 450 vs 411

Reasons to consider the Intel Core 2 Duo T5550

  • Around 31% higher clock speed: 1.83 GHz vs 1.4 GHz
  • 4x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 5% better performance in PassMark - Single thread mark: 680 vs 645
Specifications (specs)
Maximum frequency 1.83 GHz vs 1.4 GHz
L2 cache 2048 KB vs 512 KB
Benchmarks
PassMark - Single thread mark 680 vs 645

Compare benchmarks

CPU 1: Intel Celeron 877
CPU 2: Intel Core 2 Duo T5550

PassMark - Single thread mark
CPU 1
CPU 2
645
680
PassMark - CPU mark
CPU 1
CPU 2
692
637
Geekbench 4 - Single Core
CPU 1
CPU 2
252
243
Geekbench 4 - Multi-Core
CPU 1
CPU 2
450
411
Name Intel Celeron 877 Intel Core 2 Duo T5550
PassMark - Single thread mark 645 680
PassMark - CPU mark 692 637
Geekbench 4 - Single Core 252 243
Geekbench 4 - Multi-Core 450 411

Compare specifications (specs)

Intel Celeron 877 Intel Core 2 Duo T5550

Essentials

Architecture codename Sandy Bridge Merom
Launch date 1 December 2011 1 January 2008
Place in performance rating 3040 3035
Processor Number 877 T5550
Series Legacy Intel® Celeron® Processor Legacy Intel® Core™ Processors
Status Launched Discontinued
Vertical segment Mobile Mobile

Performance

64 bit support
Base frequency 1.40 GHz 1.83 GHz
Bus Speed 5 GT/s DMI 667 MHz FSB
Die size 131 mm 143 mm2
L1 cache 128 KB
L2 cache 512 KB 2048 KB
L3 cache 2048 KB
Manufacturing process technology 32 nm 65 nm
Maximum core temperature 100 °C 100°C
Maximum frequency 1.4 GHz 1.83 GHz
Number of cores 2 2
Number of threads 2 2
Transistor count 504 million 291 million
Front-side bus (FSB) 667 MHz
VID voltage range 1.075V-1.250V

Memory

Max memory channels 2
Maximum memory bandwidth 21.3 GB/s
Maximum memory size 16 GB
Supported memory types DDR3 1066/1333

Graphics

Graphics base frequency 350 MHz
Graphics max dynamic frequency 1.00 GHz
Graphics max frequency 1 GHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel HD Graphics

Graphics interfaces

CRT
DisplayPort
eDP
HDMI
Number of displays supported 2
SDVO
Wireless Display (WiDi) support

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size 31.0mm x 24.0mm (BGA1023) 35mm x 35mm
Sockets supported BGA1023 PPGA478
Thermal Design Power (TDP) 17 Watt 35 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0
PCIe configurations 1x16, 2x8, 1x8 2x4

Security & Reliability

Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
FSB parity

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)

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