Intel Celeron M U3400 vs Intel Core 2 Duo SP9300
Comparative analysis of Intel Celeron M U3400 and Intel Core 2 Duo SP9300 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Celeron M U3400
- CPU is newer: launch date 1 year(s) 9 month(s) later
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- Around 39% lower typical power consumption: 18 Watt vs 25 Watt
| Launch date | 24 May 2010 vs 20 August 2008 |
| Manufacturing process technology | 32 nm vs 45 nm |
| Thermal Design Power (TDP) | 18 Watt vs 25 Watt |
Reasons to consider the Intel Core 2 Duo SP9300
- Around 113% higher clock speed: 2.26 GHz vs 1.06 GHz
- 12x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 84% better performance in Geekbench 4 - Single Core: 297 vs 161
- Around 85% better performance in Geekbench 4 - Multi-Core: 568 vs 307
| Specifications (specs) | |
| Maximum frequency | 2.26 GHz vs 1.06 GHz |
| L2 cache | 6 MB vs 512 KB |
| Benchmarks | |
| Geekbench 4 - Single Core | 297 vs 161 |
| Geekbench 4 - Multi-Core | 568 vs 307 |
Compare benchmarks
CPU 1: Intel Celeron M U3400
CPU 2: Intel Core 2 Duo SP9300
| Geekbench 4 - Single Core |
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| Geekbench 4 - Multi-Core |
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| Name | Intel Celeron M U3400 | Intel Core 2 Duo SP9300 |
|---|---|---|
| PassMark - Single thread mark | 456 | |
| PassMark - CPU mark | 516 | |
| Geekbench 4 - Single Core | 161 | 297 |
| Geekbench 4 - Multi-Core | 307 | 568 |
Compare specifications (specs)
| Intel Celeron M U3400 | Intel Core 2 Duo SP9300 | |
|---|---|---|
Essentials |
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| Architecture codename | Arrandale | Penryn |
| Launch date | 24 May 2010 | 20 August 2008 |
| Place in performance rating | 3228 | 3217 |
| Processor Number | U3400 | SP9300 |
| Series | Legacy Intel® Celeron® Processor | Legacy Intel® Core™ Processors |
| Status | Discontinued | Discontinued |
| Vertical segment | Mobile | Mobile |
| Launch price (MSRP) | $284 | |
Performance |
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| 64 bit support | ||
| Base frequency | 1.06 GHz | 2.26 GHz |
| Bus Speed | 2.5 GT/s DMI | 1066 MHz FSB |
| Die size | 81 mm2 | 107 mm2 |
| Front-side bus (FSB) | 2500 MHz | 1066 MHz |
| L2 cache | 512 KB | 6 MB |
| L3 cache | 2048 KB | |
| Manufacturing process technology | 32 nm | 45 nm |
| Maximum core temperature | 105°C | 105°C |
| Maximum frequency | 1.06 GHz | 2.26 GHz |
| Number of cores | 2 | 2 |
| Number of threads | 2 | 2 |
| Transistor count | 382 million | 410 million |
| VID voltage range | 1.050V - 1.150V | |
Memory |
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| Max memory channels | 2 | |
| Maximum memory bandwidth | 12.8 GB/s | |
| Maximum memory size | 8 GB | |
| Supported memory types | DDR3 800 | |
Graphics |
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| Graphics base frequency | 166 MHz | |
| Graphics max dynamic frequency | 500 MHz | |
| Intel® Clear Video technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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| Number of displays supported | 2 | |
Compatibility |
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| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Package Size | BGA 34mm x 28mm | 22mm x 22mm |
| Sockets supported | BGA1288 | BGA956 |
| Thermal Design Power (TDP) | 18 Watt | 25 Watt |
Peripherals |
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| Max number of PCIe lanes | 16 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | 1x16 | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Physical Address Extensions (PAE) | 36-bit | |
| Thermal Monitoring | ||
| FSB parity | ||
| Intel® Demand Based Switching | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||