Architecture codename |
Amber Lake Y |
Haswell |
Launch date |
Q1'21 |
June 2013 |
Place in performance rating |
1592 |
1590 |
Processor Number |
i3-10100Y |
i5-4570TE |
Series |
10th Generation Intel Core i3 Processors |
4th Generation Intel® Core™ i5 Processors |
Status |
Launched |
Launched |
Vertical segment |
Mobile |
Embedded |
Launch price (MSRP) |
|
$239 |
Price now |
|
$198.99 |
Value for money (0-100) |
|
5.67 |
64 bit support |
|
|
Base frequency |
1.30 GHz |
2.70 GHz |
Bus Speed |
4 GT/s |
5 GT/s DMI |
Manufacturing process technology |
14 nm |
22 nm |
Maximum core temperature |
100°C |
66.35°C |
Maximum frequency |
3.90 GHz |
3.30 GHz |
Die size |
|
177 mm |
L1 cache |
|
64 KB (per core) |
L2 cache |
|
256 KB (per core) |
L3 cache |
|
4096 KB (shared) |
Maximum case temperature (TCase) |
|
72 °C |
Number of cores |
|
2 |
Number of threads |
|
4 |
Transistor count |
|
1400 million |
Max memory channels |
2 |
2 |
Maximum memory bandwidth |
33.3 GB/s |
25.6 GB/s |
Maximum memory size |
16 GB |
32 GB |
Supported memory types |
LPDDR3-1866, DDR3L-1600 |
DDR3 1333/1600 |
ECC memory support |
|
|
Device ID |
0x591C |
|
Execution Units |
24 |
|
Graphics base frequency |
300 MHz |
350 MHz |
Graphics max dynamic frequency |
1.00 GHz |
1.00 GHz |
Intel® Clear Video HD technology |
|
|
Intel® Clear Video technology |
|
|
Intel® Quick Sync Video |
|
|
Max video memory |
16 GB |
1.7 GB |
Processor graphics |
Intel UHD Graphics 615 |
Intel® HD Graphics 4600 |
Graphics max frequency |
|
1 GHz |
Intel® Flexible Display Interface (Intel® FDI) |
|
|
Intel® InTru™ 3D technology |
|
|
DisplayPort |
|
|
DVI |
|
|
eDP |
|
|
HDMI |
|
|
Number of displays supported |
3 |
3 |
Wireless Display (WiDi) support |
|
|
4K resolution support |
|
|
Max resolution over DisplayPort |
3840x2160@60Hz |
|
Max resolution over eDP |
3840x2160@60Hz |
|
DirectX |
12 |
|
OpenGL |
4.5 |
|
Configurable TDP-down |
3.5 Watt |
|
Configurable TDP-down Frequency |
600 MHz |
|
Configurable TDP-up |
7 Watt |
|
Configurable TDP-up Frequency |
1.60 GHz |
|
Max number of CPUs in a configuration |
1 |
1 |
Package Size |
20mm X 16.5mm |
37.5mm x 37.5mm (LGA 1150) |
Thermal Design Power (TDP) |
5 Watt |
35 Watt |
Low Halogen Options Available |
|
|
Sockets supported |
|
FCLGA1150 |
Thermal Solution |
|
PCG 2013A |
Max number of PCIe lanes |
10 |
16 |
PCI Express revision |
3.0 |
3.0 |
PCIe configurations |
1x4, 2x2, 1x2+2x1 and 4x1 |
Up to 1x16, 2x8, 1x8 2x4 |
Scalability |
|
1S Only |
Execute Disable Bit (EDB) |
|
|
Intel® Identity Protection technology |
|
|
Intel® Memory Protection Extensions (Intel® MPX) |
|
|
Intel® OS Guard |
|
|
Intel® Secure Key technology |
|
|
Intel® Trusted Execution technology (TXT) |
|
|
Anti-Theft technology |
|
|
Enhanced Intel SpeedStep® technology |
|
|
Idle States |
|
|
Instruction set extensions |
Intel SSE4.1, Intel SSE4.2, Intel AVX2 |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 |
|
|
Intel® AES New Instructions |
|
|
Intel® Flex Memory Access |
|
|
Intel® Hyper-Threading technology |
|
|
Intel® Stable Image Platform Program (SIPP) |
|
|
Intel® Turbo Boost technology |
|
|
Speed Shift technology |
|
|
Thermal Monitoring |
|
|
Flexible Display interface (FDI) |
|
|
Intel® Advanced Vector Extensions (AVX) |
|
|
Intel® My WiFi technology |
|
|
Intel® TSX-NI |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|