| Architecture codename |
Amber Lake Y |
Haswell |
| Launch date |
Q1'21 |
June 2013 |
| Place in performance rating |
1576 |
1573 |
| Processor Number |
i3-10100Y |
i5-4570TE |
| Series |
10th Generation Intel Core i3 Processors |
4th Generation Intel® Core™ i5 Processors |
| Status |
Launched |
Launched |
| Vertical segment |
Mobile |
Embedded |
| Launch price (MSRP) |
|
$239 |
| Price now |
|
$198.99 |
| Value for money (0-100) |
|
5.67 |
| 64 bit support |
|
|
| Base frequency |
1.30 GHz |
2.70 GHz |
| Bus Speed |
4 GT/s |
5 GT/s DMI |
| Manufacturing process technology |
14 nm |
22 nm |
| Maximum core temperature |
100°C |
66.35°C |
| Maximum frequency |
3.90 GHz |
3.30 GHz |
| Die size |
|
177 mm |
| L1 cache |
|
64 KB (per core) |
| L2 cache |
|
256 KB (per core) |
| L3 cache |
|
4096 KB (shared) |
| Maximum case temperature (TCase) |
|
72 °C |
| Number of cores |
|
2 |
| Number of threads |
|
4 |
| Transistor count |
|
1400 million |
| Max memory channels |
2 |
2 |
| Maximum memory bandwidth |
33.3 GB/s |
25.6 GB/s |
| Maximum memory size |
16 GB |
32 GB |
| Supported memory types |
LPDDR3-1866, DDR3L-1600 |
DDR3 1333/1600 |
| ECC memory support |
|
|
| Device ID |
0x591C |
|
| Execution Units |
24 |
|
| Graphics base frequency |
300 MHz |
350 MHz |
| Graphics max dynamic frequency |
1.00 GHz |
1.00 GHz |
| Intel® Clear Video HD technology |
|
|
| Intel® Clear Video technology |
|
|
| Intel® Quick Sync Video |
|
|
| Max video memory |
16 GB |
1.7 GB |
| Processor graphics |
Intel UHD Graphics 615 |
Intel® HD Graphics 4600 |
| Graphics max frequency |
|
1 GHz |
| Intel® Flexible Display Interface (Intel® FDI) |
|
|
| Intel® InTru™ 3D technology |
|
|
| DisplayPort |
|
|
| DVI |
|
|
| eDP |
|
|
| HDMI |
|
|
| Number of displays supported |
3 |
3 |
| Wireless Display (WiDi) support |
|
|
| 4K resolution support |
|
|
| Max resolution over DisplayPort |
3840x2160@60Hz |
|
| Max resolution over eDP |
3840x2160@60Hz |
|
| DirectX |
12 |
|
| OpenGL |
4.5 |
|
| Configurable TDP-down |
3.5 Watt |
|
| Configurable TDP-down Frequency |
600 MHz |
|
| Configurable TDP-up |
7 Watt |
|
| Configurable TDP-up Frequency |
1.60 GHz |
|
| Max number of CPUs in a configuration |
1 |
1 |
| Package Size |
20mm X 16.5mm |
37.5mm x 37.5mm (LGA 1150) |
| Thermal Design Power (TDP) |
5 Watt |
35 Watt |
| Low Halogen Options Available |
|
|
| Sockets supported |
|
FCLGA1150 |
| Thermal Solution |
|
PCG 2013A |
| Max number of PCIe lanes |
10 |
16 |
| PCI Express revision |
3.0 |
3.0 |
| PCIe configurations |
1x4, 2x2, 1x2+2x1 and 4x1 |
Up to 1x16, 2x8, 1x8 2x4 |
| Scalability |
|
1S Only |
| Execute Disable Bit (EDB) |
|
|
| Intel® Identity Protection technology |
|
|
| Intel® Memory Protection Extensions (Intel® MPX) |
|
|
| Intel® OS Guard |
|
|
| Intel® Secure Key technology |
|
|
| Intel® Trusted Execution technology (TXT) |
|
|
| Anti-Theft technology |
|
|
| Enhanced Intel SpeedStep® technology |
|
|
| Idle States |
|
|
| Instruction set extensions |
Intel SSE4.1, Intel SSE4.2, Intel AVX2 |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
| Intel 64 |
|
|
| Intel® AES New Instructions |
|
|
| Intel® Flex Memory Access |
|
|
| Intel® Hyper-Threading technology |
|
|
| Intel® Stable Image Platform Program (SIPP) |
|
|
| Intel® Turbo Boost technology |
|
|
| Speed Shift technology |
|
|
| Thermal Monitoring |
|
|
| Flexible Display interface (FDI) |
|
|
| Intel® Advanced Vector Extensions (AVX) |
|
|
| Intel® My WiFi technology |
|
|
| Intel® TSX-NI |
|
|
| Intel® vPro™ Platform Eligibility |
|
|
| Intel® Virtualization Technology (VT-x) |
|
|
| Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
| Intel® VT-x with Extended Page Tables (EPT) |
|
|