Nom de code de l’architecture |
Amber Lake Y |
Haswell |
Date de sortie |
Q1'21 |
June 2013 |
Position dans l’évaluation de la performance |
1592 |
1590 |
Processor Number |
i3-10100Y |
i5-4570TE |
Série |
10th Generation Intel Core i3 Processors |
4th Generation Intel® Core™ i5 Processors |
Status |
Launched |
Launched |
Segment vertical |
Mobile |
Embedded |
Prix de sortie (MSRP) |
|
$239 |
Prix maintenant |
|
$198.99 |
Valeur pour le prix (0-100) |
|
5.67 |
Soutien de 64-bit |
|
|
Base frequency |
1.30 GHz |
2.70 GHz |
Bus Speed |
4 GT/s |
5 GT/s DMI |
Processus de fabrication |
14 nm |
22 nm |
Température de noyau maximale |
100°C |
66.35°C |
Fréquence maximale |
3.90 GHz |
3.30 GHz |
Taille de dé |
|
177 mm |
Cache L1 |
|
64 KB (per core) |
Cache L2 |
|
256 KB (per core) |
Cache L3 |
|
4096 KB (shared) |
Température maximale de la caisse (TCase) |
|
72 °C |
Nombre de noyaux |
|
2 |
Nombre de fils |
|
4 |
Compte de transistor |
|
1400 million |
Réseaux de mémoire maximale |
2 |
2 |
Bande passante de mémoire maximale |
33.3 GB/s |
25.6 GB/s |
Taille de mémore maximale |
16 GB |
32 GB |
Genres de mémoire soutenus |
LPDDR3-1866, DDR3L-1600 |
DDR3 1333/1600 |
Soutien de la mémoire ECC |
|
|
Device ID |
0x591C |
|
Unités d’éxécution |
24 |
|
Graphics base frequency |
300 MHz |
350 MHz |
Graphics max dynamic frequency |
1.00 GHz |
1.00 GHz |
Technologie Intel® Clear Video HD |
|
|
Technologie Intel® Clear Video |
|
|
Intel® Quick Sync Video |
|
|
Mémoire de vidéo maximale |
16 GB |
1.7 GB |
Graphiques du processeur |
Intel UHD Graphics 615 |
Intel® HD Graphics 4600 |
Freéquency maximale des graphiques |
|
1 GHz |
Intel® Flexible Display Interface (Intel® FDI) |
|
|
Technologie Intel® InTru™ 3D |
|
|
DisplayPort |
|
|
DVI |
|
|
eDP |
|
|
HDMI |
|
|
Nombre d’écrans soutenu |
3 |
3 |
Soutien du Wireless Display (WiDi) |
|
|
Soutien de la resolution 4K |
|
|
Résolution maximale sur DisplayPort |
3840x2160@60Hz |
|
Résolution maximale sur eDP |
3840x2160@60Hz |
|
DirectX |
12 |
|
OpenGL |
4.5 |
|
Configurable TDP-down |
3.5 Watt |
|
Configurable TDP-down Frequency |
600 MHz |
|
Configurable TDP-up |
7 Watt |
|
Configurable TDP-up Frequency |
1.60 GHz |
|
Nombre de CPUs maximale dans une configuration |
1 |
1 |
Package Size |
20mm X 16.5mm |
37.5mm x 37.5mm (LGA 1150) |
Thermal Design Power (TDP) |
5 Watt |
35 Watt |
Low Halogen Options Available |
|
|
Prise courants soutenu |
|
FCLGA1150 |
Thermal Solution |
|
PCG 2013A |
Nombre maximale des voies PCIe |
10 |
16 |
Révision PCI Express |
3.0 |
3.0 |
PCIe configurations |
1x4, 2x2, 1x2+2x1 and 4x1 |
Up to 1x16, 2x8, 1x8 2x4 |
Scalability |
|
1S Only |
Execute Disable Bit (EDB) |
|
|
Technologie Intel® Identity Protection |
|
|
Intel® Memory Protection Extensions (Intel® MPX) |
|
|
Intel® OS Guard |
|
|
Technologie Intel® Secure Key |
|
|
Technologie Intel® Trusted Execution (TXT) |
|
|
Technologie Anti-Theft |
|
|
Technologie Enhanced Intel SpeedStep® |
|
|
Idle States |
|
|
Extensions de l’ensemble d’instructions |
Intel SSE4.1, Intel SSE4.2, Intel AVX2 |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 |
|
|
Intel® AES New Instructions |
|
|
Intel® Flex Memory Access |
|
|
Technologie Intel® Hyper-Threading |
|
|
Intel® Stable Image Platform Program (SIPP) |
|
|
Technologie Intel® Turbo Boost |
|
|
Speed Shift technology |
|
|
Thermal Monitoring |
|
|
Flexible Display interface (FDI) |
|
|
Intel® Advanced Vector Extensions (AVX) |
|
|
Technologie Intel® My WiFi |
|
|
Intel® TSX-NI |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|