Intel Core i3-2330M vs AMD Mobile Sempron SI-42

Comparative analysis of Intel Core i3-2330M and AMD Mobile Sempron SI-42 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

Intel Core i3-2330M

AMD Mobile Sempron SI-42

Differences

Reasons to consider the Intel Core i3-2330M

CPU is newer: launch date 1 year(s) 8 month(s) later
1 more cores, run more applications at once: 2 vs 1
3 more threads: 4 vs 1
Around 5% higher clock speed: 2.2 GHz vs 2.1 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
Around 52% better performance in PassMark - Single thread mark: 967 vs 637
5.1x better performance in PassMark - CPU mark: 1247 vs 245

Specifications (specs)
Launch date	15 May 2011 vs 1 September 2009
Number of cores	2 vs 1
Number of threads	4 vs 1
Maximum frequency	2.2 GHz vs 2.1 GHz
Manufacturing process technology	32 nm vs 65 nm
Benchmarks
PassMark - Single thread mark	967 vs 637
PassMark - CPU mark	1247 vs 245

Reasons to consider the AMD Mobile Sempron SI-42

Around 18% higher maximum core temperature: 100 °C vs 85C (PGA); 100C (BGA)
Around 40% lower typical power consumption: 25 Watt vs 35 Watt
2.4x better performance in Geekbench 4 - Single Core: 887 vs 371
Around 2% better performance in Geekbench 4 - Multi-Core: 829 vs 816

Specifications (specs)
Maximum core temperature	100 °C vs 85C (PGA); 100C (BGA)
Thermal Design Power (TDP)	25 Watt vs 35 Watt
Benchmarks
Geekbench 4 - Single Core	887 vs 371
Geekbench 4 - Multi-Core	829 vs 816

Compare benchmarks

CPU 1: Intel Core i3-2330M
CPU 2: AMD Mobile Sempron SI-42

PassMark - Single thread mark

CPU 1

CPU 2

967

637

PassMark - CPU mark

CPU 1

CPU 2

1247

245

Geekbench 4 - Single Core

CPU 1

CPU 2

371

887

Geekbench 4 - Multi-Core

CPU 1

CPU 2

816

829

Name	Intel Core i3-2330M	AMD Mobile Sempron SI-42
PassMark - Single thread mark	967	637
PassMark - CPU mark	1247	245
Geekbench 4 - Single Core	371	887
Geekbench 4 - Multi-Core	816	829
CompuBench 1.5 Desktop - Face Detection (mPixels/s)	1.346
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)	24.484
CompuBench 1.5 Desktop - T-Rex (Frames/s)	0.176
CompuBench 1.5 Desktop - Video Composition (Frames/s)	0.618
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)	1.487

Compare specifications (specs)

	Intel Core i3-2330M	AMD Mobile Sempron SI-42
Essentials
Architecture codename	Sandy Bridge	Sable
Launch date	15 May 2011	1 September 2009
Launch price (MSRP)	$19
Place in performance rating	3110	2618
Price now	$170.20
Processor Number	i3-2330M
Series	Legacy Intel® Core™ Processors	AMD Mobile Sempron
Status	Launched
Value for money (0-100)	4.36
Vertical segment	Mobile	Laptop
Performance
64 bit support
Base frequency	2.20 GHz
Bus Speed	5 GT/s DMI
Die size	149 mm
L1 cache	128 KB	128 KB
L2 cache	512 KB	512 KB
L3 cache	3072 KB
Manufacturing process technology	32 nm	65 nm
Maximum core temperature	85C (PGA); 100C (BGA)	100 °C
Maximum frequency	2.2 GHz	2.1 GHz
Number of cores	2	1
Number of threads	4	1
Transistor count	624 Million
Front-side bus (FSB)		1800 MHz
Memory
Max memory channels	2
Maximum memory bandwidth	21.3 GB/s
Maximum memory size	16 GB
Supported memory types	DDR3 1066/1333
Graphics
Device ID	0x116
Graphics base frequency	650 MHz
Graphics max dynamic frequency	1.10 GHz
Graphics max frequency	1.1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel® HD Graphics 3000
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported	2
SDVO
Wireless Display (WiDi) support
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	37.5mm x 37.5mm (rPGA988B); 31mm x 24mm (BGA1023)
Sockets supported	FCBGA1023, PPGA988	S1g2
Thermal Design Power (TDP)	35 Watt	25 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16, 2x8, 1x8 2x4
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)