Intel Core i3-3115C vs Intel Core i7-2610UE

Comparative analysis of Intel Core i3-3115C and Intel Core i7-2610UE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization, Graphics, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Core i3-3115C

Intel Core i7-2610UE

Differences

Reasons to consider the Intel Core i3-3115C

A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
Around 93% higher maximum memory size: 32 GB vs 16.6 GB

Manufacturing process technology	22 nm vs 32 nm
Maximum memory size	32 GB vs 16.6 GB

Reasons to consider the Intel Core i7-2610UE

Around 47% lower typical power consumption: 17 Watt vs 25 Watt

Thermal Design Power (TDP)	17 Watt vs 25 Watt

Compare benchmarks

CPU 1: Intel Core i3-3115C
CPU 2: Intel Core i7-2610UE

Name	Intel Core i3-3115C	Intel Core i7-2610UE
PassMark - Single thread mark		1051
PassMark - CPU mark		1527

Compare specifications (specs)

	Intel Core i3-3115C	Intel Core i7-2610UE
Essentials
Architecture codename	Gladden	Sandy Bridge
Launch date	Q3'13	Q1'11
Place in performance rating	not rated	2216
Processor Number	i3-3115C	i7-2610UE
Series	Legacy Intel® Core™ Processors	Legacy Intel® Core™ Processors
Status	Launched	Launched
Vertical segment	Embedded	Embedded
Performance
64 bit support
Base frequency	2.50 GHz	1.50 GHz
Bus Speed	5 GT/s DMI2	5 GT/s DMI
Manufacturing process technology	22 nm	32 nm
Maximum core temperature	100°C	100 C
Number of cores	2	2
Number of threads	4	4
Maximum frequency		2.40 GHz
Memory
Max memory channels	2	2
Maximum memory bandwidth	21.3 GB/s
Maximum memory size	32 GB	16.6 GB
Supported memory types	DDR3/DDR3L 1066/1333	DDR3 1066/1333
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	37.5mm x 37.5mm	31mm x 24mm (FCBGA1023)
Sockets supported	FCBGA1284	FCBGA1023
Thermal Design Power (TDP)	25 Watt	17 Watt
Peripherals
Max number of PCIe lanes	20	16
PCI Express revision	3.0	2.0
PCIe configurations	1x16 & 1x4, 2x8 & 1x4 or 1x8 & 3x4	1x16, 2x8, 1x8+2x4
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Intel® Identity Protection technology
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX	Intel® AVX
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Thermal Monitoring
Intel® Demand Based Switching
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Graphics
Graphics base frequency		350 MHz
Graphics max dynamic frequency		850 MHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics		Intel® HD Graphics 3000
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported		2
SDVO