Intel Core i3-3115C vs Intel Core i7-660UE
Comparative analysis of Intel Core i3-3115C and Intel Core i7-660UE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization, Graphics, Graphics interfaces.
Differences
Reasons to consider the Intel Core i3-3115C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- 3.6x more maximum memory size: 32 GB vs 8.79 GB
| Manufacturing process technology | 22 nm vs 32 nm |
| Maximum memory size | 32 GB vs 8.79 GB |
Reasons to consider the Intel Core i7-660UE
- Around 5% higher maximum core temperature: 105°C vs 100°C
- Around 39% lower typical power consumption: 18 Watt vs 25 Watt
| Maximum core temperature | 105°C vs 100°C |
| Thermal Design Power (TDP) | 18 Watt vs 25 Watt |
Compare specifications (specs)
| Intel Core i3-3115C | Intel Core i7-660UE | |
|---|---|---|
Essentials |
||
| Architecture codename | Gladden | Arrandale |
| Launch date | Q3'13 | Q1'10 |
| Place in performance rating | not rated | not rated |
| Processor Number | i3-3115C | i7-660UE |
| Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
| Status | Launched | Launched |
| Vertical segment | Embedded | Mobile |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.50 GHz | 1.33 GHz |
| Bus Speed | 5 GT/s DMI2 | 2.5 GT/s DMI |
| Manufacturing process technology | 22 nm | 32 nm |
| Maximum core temperature | 100°C | 105°C |
| Number of cores | 2 | 2 |
| Number of threads | 4 | 4 |
| Die size | 81 mm2 | |
| Maximum frequency | 2.40 GHz | |
| Transistor count | 382 million | |
Memory |
||
| Max memory channels | 2 | 2 |
| Maximum memory bandwidth | 21.3 GB/s | 12.8 GB/s |
| Maximum memory size | 32 GB | 8.79 GB |
| Supported memory types | DDR3/DDR3L 1066/1333 | DDR3 800 |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 37.5mm x 37.5mm | BGA 34mmX28mm |
| Sockets supported | FCBGA1284 | BGA1288 |
| Thermal Design Power (TDP) | 25 Watt | 18 Watt |
Peripherals |
||
| Max number of PCIe lanes | 20 | 16 |
| PCI Express revision | 3.0 | 2.0 |
| PCIe configurations | 1x16 & 1x4, 2x8 & 1x4 or 1x8 & 3x4 | 1X16, 2X8 |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX | Intel® SSE4.1, Intel® SSE4.2 |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Thermal Monitoring | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Physical Address Extensions (PAE) | 36-bit | |
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics |
||
| Graphics base frequency | 166 MHz | |
| Graphics max dynamic frequency | 500 MHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Processor graphics | Intel HD Graphics | |
Graphics interfaces |
||
| Number of displays supported | 2 | |
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