Intel Core i3-6167U vs Intel Core i5-4570TE
Comparative analysis of Intel Core i3-6167U and Intel Core i5-4570TE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Core i3-6167U
- CPU is newer: launch date 2 year(s) 3 month(s) later
- Around 51% higher maximum core temperature: 100°C vs 66.35°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
- Around 25% lower typical power consumption: 28 Watt vs 35 Watt
| Launch date | 1 September 2015 vs June 2013 |
| Maximum core temperature | 100°C vs 66.35°C |
| Manufacturing process technology | 14 nm vs 22 nm |
| Thermal Design Power (TDP) | 28 Watt vs 35 Watt |
Reasons to consider the Intel Core i5-4570TE
- Around 22% higher clock speed: 3.30 GHz vs 2.7 GHz
- Around 33% more L3 cache; more data can be stored in the L3 cache for quick access later
| Maximum frequency | 3.30 GHz vs 2.7 GHz |
| L3 cache | 4096 KB (shared) vs 3 MB |
Compare benchmarks
CPU 1: Intel Core i3-6167U
CPU 2: Intel Core i5-4570TE
| Name | Intel Core i3-6167U | Intel Core i5-4570TE |
|---|---|---|
| GFXBench 4.0 - Manhattan (Frames) | 1252 | |
| GFXBench 4.0 - Manhattan (Fps) | 1252 | |
| PassMark - Single thread mark | 1622 | |
| PassMark - CPU mark | 3074 |
Compare specifications (specs)
| Intel Core i3-6167U | Intel Core i5-4570TE | |
|---|---|---|
Essentials |
||
| Architecture codename | Skylake | Haswell |
| Launch date | 1 September 2015 | June 2013 |
| Place in performance rating | 1587 | 1589 |
| Processor Number | i3-6167U | i5-4570TE |
| Series | 6th Generation Intel® Core™ i3 Processors | 4th Generation Intel® Core™ i5 Processors |
| Status | Launched | Launched |
| Vertical segment | Mobile | Embedded |
| Launch price (MSRP) | $239 | |
| Price now | $198.99 | |
| Value for money (0-100) | 5.67 | |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.70 GHz | 2.70 GHz |
| Bus Speed | 4 GT/s OPI | 5 GT/s DMI |
| L1 cache | 128 KB | 64 KB (per core) |
| L2 cache | 512 KB | 256 KB (per core) |
| L3 cache | 3 MB | 4096 KB (shared) |
| Manufacturing process technology | 14 nm | 22 nm |
| Maximum core temperature | 100°C | 66.35°C |
| Maximum frequency | 2.7 GHz | 3.30 GHz |
| Number of cores | 2 | 2 |
| Number of threads | 4 | 4 |
| Die size | 177 mm | |
| Maximum case temperature (TCase) | 72 °C | |
| Transistor count | 1400 million | |
Memory |
||
| Max memory channels | 2 | 2 |
| Maximum memory bandwidth | 34.1 GB/s | 25.6 GB/s |
| Maximum memory size | 32 GB | 32 GB |
| Supported memory types | DDR4-2133, LPDDR3-1866, DDR3L-1600 | DDR3 1333/1600 |
| ECC memory support | ||
Graphics |
||
| Device ID | 0x1927 | |
| eDRAM | 64 MB | |
| Graphics base frequency | 300 MHz | 350 MHz |
| Graphics max dynamic frequency | 1.00 GHz | 1.00 GHz |
| Graphics max frequency | 1 GHz | 1 GHz |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 32 GB | 1.7 GB |
| Processor graphics | Intel® Iris® Graphics 550 | Intel® HD Graphics 4600 |
| Intel® Flexible Display Interface (Intel® FDI) | ||
Graphics interfaces |
||
| DisplayPort | ||
| DVI | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | 3 |
| Wireless Display (WiDi) support | ||
Graphics image quality |
||
| 4K resolution support | ||
| Max resolution over DisplayPort | 4096x2304@60Hz | |
| Max resolution over eDP | 4096x2304@60Hz | |
| Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
| Max resolution over VGA | N / A | |
| Max resolution over WiDi | 1080p | |
Graphics API support |
||
| DirectX | 12 | |
| OpenGL | 4.5 | |
Compatibility |
||
| Configurable TDP-down | 23 W | |
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 42mm X 24mm | 37.5mm x 37.5mm (LGA 1150) |
| Sockets supported | FCBGA1356 | FCLGA1150 |
| Thermal Design Power (TDP) | 28 Watt | 35 Watt |
| Thermal Solution | PCG 2013A | |
Peripherals |
||
| Max number of PCIe lanes | 12 | 16 |
| PCI Express revision | 3.0 | 3.0 |
| PCIe configurations | 1x4, 2x2, 1x2+2x1 and 4x1 | Up to 1x16, 2x8, 1x8 2x4 |
| Scalability | 1S Only | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Memory Protection Extensions (Intel® MPX) | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Anti-Theft technology | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
| Intel 64 | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® My WiFi technology | ||
| Intel® Smart Response technology | ||
| Intel® Stable Image Platform Program (SIPP) | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
| Flexible Display interface (FDI) | ||
Virtualization |
||
| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
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