Intel Xeon Platinum 8170 vs AMD Opteron 4332 HE
Comparative analysis of Intel Xeon Platinum 8170 and AMD Opteron 4332 HE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon Platinum 8170
- 20 more cores, run more applications at once: 26 vs 6
- 46 more threads: 52 vs 6
- Around 31% higher maximum core temperature: 89°C vs 68°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 32 nm
Number of cores | 26 vs 6 |
Number of threads | 52 vs 6 |
Maximum core temperature | 89°C vs 68°C |
Manufacturing process technology | 14 nm vs 32 nm |
Reasons to consider the AMD Opteron 4332 HE
- 2.5x lower typical power consumption: 65 Watt vs 165 Watt
Thermal Design Power (TDP) | 65 Watt vs 165 Watt |
Compare benchmarks
CPU 1: Intel Xeon Platinum 8170
CPU 2: AMD Opteron 4332 HE
Name | Intel Xeon Platinum 8170 | AMD Opteron 4332 HE |
---|---|---|
Geekbench 4 - Single Core | 4221 | |
Geekbench 4 - Multi-Core | 33793 | |
PassMark - Single thread mark | 1285 | |
PassMark - CPU mark | 5614 |
Compare specifications (specs)
Intel Xeon Platinum 8170 | AMD Opteron 4332 HE | |
---|---|---|
Essentials |
||
Architecture codename | Skylake | Seoul |
Launch date | Q3'17 | n/d |
Place in performance rating | 4 | 1728 |
Processor Number | 8170 | |
Series | Intel® Xeon® Scalable Processors | AMD Opteron 4300 Series Processor |
Status | Launched | |
Vertical segment | Server | Server |
Family | AMD Opteron | |
OPN Tray | OS4332OFU6KHK | |
Performance |
||
Base frequency | 2.10 GHz | 3 GHz |
Manufacturing process technology | 14 nm | 32 nm |
Maximum core temperature | 89°C | 68°C |
Maximum frequency | 3.70 GHz | 3.7 GHz |
Number of cores | 26 | 6 |
Number of threads | 52 | 6 |
Number of Ultra Path Interconnect (UPI) Links | 3 | |
64 bit support | ||
Die size | 315 mm | |
L1 cache | 288 KB | |
L2 cache | 6 MB | |
L3 cache | 8 MB | |
Transistor count | 1200 million | |
Unlocked | ||
Memory |
||
Max memory channels | 6 | |
Maximum memory size | 768 GB | |
Supported memory frequency | 2666 MHz | 2000 MHz |
Supported memory types | DDR4-2666 | DDR3 |
Compatibility |
||
Low Halogen Options Available | ||
Package Size | 76.0mm x 56.5mm | |
Sockets supported | FCLGA3647 | C32 |
Thermal Design Power (TDP) | 165 Watt | 65 Watt |
Max number of CPUs in a configuration | 2 | |
Peripherals |
||
Max number of PCIe lanes | 48 | |
PCI Express revision | 3.0 | |
Scalability | S8S | |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Run Sure Technology | ||
Intel® Trusted Execution technology (TXT) | ||
Mode-based Execute Control (MBE) | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
Instruction set extensions | Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® Volume Management Device (VMD) | ||
Intel® vPro™ Platform Eligibility | ||
Number of AVX-512 FMA Units | 2 | |
Speed Shift technology | ||
Fused Multiply-Add (FMA) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) |