Intel Xeon Platinum 8170 vs Intel Xeon Gold 6136
Comparative analysis of Intel Xeon Platinum 8170 and Intel Xeon Gold 6136 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon Platinum 8170
- 14 more cores, run more applications at once: 26 vs 12
- 28 more threads: 52 vs 24
- Around 5% higher maximum core temperature: 89°C vs 85°C
- Around 7% better performance in Geekbench 4 - Multi-Core: 33793 vs 31493
Specifications (specs) | |
Number of cores | 26 vs 12 |
Number of threads | 52 vs 24 |
Maximum core temperature | 89°C vs 85°C |
Benchmarks | |
Geekbench 4 - Multi-Core | 33793 vs 31493 |
Reasons to consider the Intel Xeon Gold 6136
- Around 10% lower typical power consumption: 150 Watt vs 165 Watt
- Around 3% better performance in Geekbench 4 - Single Core: 4351 vs 4221
Specifications (specs) | |
Thermal Design Power (TDP) | 150 Watt vs 165 Watt |
Benchmarks | |
Geekbench 4 - Single Core | 4351 vs 4221 |
Compare benchmarks
CPU 1: Intel Xeon Platinum 8170
CPU 2: Intel Xeon Gold 6136
Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Xeon Platinum 8170 | Intel Xeon Gold 6136 |
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Geekbench 4 - Single Core | 4221 | 4351 |
Geekbench 4 - Multi-Core | 33793 | 31493 |
PassMark - Single thread mark | 2170 | |
PassMark - CPU mark | 36329 |
Compare specifications (specs)
Intel Xeon Platinum 8170 | Intel Xeon Gold 6136 | |
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Essentials |
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Architecture codename | Skylake | Skylake |
Launch date | Q3'17 | Q3'17 |
Place in performance rating | 4 | 61 |
Processor Number | 8170 | 6136 |
Series | Intel® Xeon® Scalable Processors | Intel® Xeon® Scalable Processors |
Status | Launched | Launched |
Vertical segment | Server | Server |
Performance |
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Base frequency | 2.10 GHz | 3.00 GHz |
Manufacturing process technology | 14 nm | 14 nm |
Maximum core temperature | 89°C | 85°C |
Maximum frequency | 3.70 GHz | 3.70 GHz |
Number of cores | 26 | 12 |
Number of threads | 52 | 24 |
Number of Ultra Path Interconnect (UPI) Links | 3 | 3 |
Memory |
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Max memory channels | 6 | 6 |
Maximum memory size | 768 GB | 768 GB |
Supported memory frequency | 2666 MHz | 2666 MHz |
Supported memory types | DDR4-2666 | DDR4-2666 |
Compatibility |
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Low Halogen Options Available | ||
Package Size | 76.0mm x 56.5mm | 76.0mm x 56.5mm |
Sockets supported | FCLGA3647 | FCLGA3647 |
Thermal Design Power (TDP) | 165 Watt | 150 Watt |
Peripherals |
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Max number of PCIe lanes | 48 | 48 |
PCI Express revision | 3.0 | 3.0 |
Scalability | S8S | S4S |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Run Sure Technology | ||
Intel® Trusted Execution technology (TXT) | ||
Mode-based Execute Control (MBE) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Instruction set extensions | Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512 | Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512 |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® Volume Management Device (VMD) | ||
Intel® vPro™ Platform Eligibility | ||
Number of AVX-512 FMA Units | 2 | 2 |
Speed Shift technology | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |