NVIDIA GeForce GTS 260M vs ATI Radeon E4690

Comparative analysis of NVIDIA GeForce GTS 260M and ATI Radeon E4690 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark, GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

 

Differences

Reasons to consider the NVIDIA GeForce GTS 260M

  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 40 nm vs 55 nm
  • 2x more maximum memory size: 1 GB vs 512 MB
Manufacturing process technology 40 nm vs 55 nm
Maximum memory size 1 GB vs 512 MB

Reasons to consider the ATI Radeon E4690

  • Around 9% higher core clock speed: 600 MHz vs 550 MHz
  • Around 9% higher texture fill rate: 19.2 GTexel / s vs 17.6 GTexel / s
  • 3.3x more pipelines: 320 vs 96
  • Around 45% better floating-point performance: 384.0 gflops vs 264 gflops
  • Around 27% lower typical power consumption: 30 Watt vs 38 Watt
Core clock speed 600 MHz vs 550 MHz
Texture fill rate 19.2 GTexel / s vs 17.6 GTexel / s
Pipelines 320 vs 96
Floating-point performance 384.0 gflops vs 264 gflops
Thermal Design Power (TDP) 30 Watt vs 38 Watt

Compare benchmarks

GPU 1: NVIDIA GeForce GTS 260M
GPU 2: ATI Radeon E4690

Name NVIDIA GeForce GTS 260M ATI Radeon E4690
PassMark - G3D Mark 405
PassMark - G2D Mark 347
GFXBench 4.0 - T-Rex (Frames) 3302
GFXBench 4.0 - T-Rex (Fps) 3302

Compare specifications (specs)

NVIDIA GeForce GTS 260M ATI Radeon E4690

Essentials

Architecture Tesla 2.0 TeraScale
Code name GT215 RV730
Launch date 15 June 2009 1 June 2009
Place in performance rating not rated 714
Type Laptop Desktop

Technical info

Core clock speed 550 MHz 600 MHz
CUDA cores 96
Floating-point performance 264 gflops 384.0 gflops
Gigaflops 396
Manufacturing process technology 40 nm 55 nm
Pipelines 96 320
Texture fill rate 17.6 GTexel / s 19.2 GTexel / s
Thermal Design Power (TDP) 38 Watt 30 Watt
Transistor count 727 million 514 million

Video outputs and ports

Display Connectors HDMIVGADual Link DVIDisplayPortSingle Link DVILVDS
Maximum VGA resolution 2048x1536

Compatibility, dimensions and requirements

Bus support PCI-E 2.0
Interface PCIe 2.0 x16 MXM-II
Laptop size large
MXM Type MXM 3.0 Type-B
SLI options 2-way

API support

DirectX 10.1 10.1
OpenGL 2.1 3.3

Memory

Maximum RAM amount 1 GB 512 MB
Memory bandwidth 57.6 GB / s 22.4 GB / s
Memory bus width 128 Bit 128 Bit
Memory type GDDR3, GDDR5 GDDR3
Shared memory 0
Memory clock speed 1400 MHz

Technologies

CUDA
HybridPower
MXM 3.0 Type-B
Power management 8.0
PowerMizer 8.0
SLI

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