NVIDIA P102-100 vs NVIDIA GRID K140Q

Comparative analysis of NVIDIA P102-100 and NVIDIA GRID K140Q videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: Geekbench - OpenCL, PassMark - G3D Mark, PassMark - G2D Mark.

 

Differences

Reasons to consider the NVIDIA P102-100

  • Videocard is newer: launch date 4 year(s) 7 month(s) later
  • Around 74% higher core clock speed: 1481 MHz vs 850 MHz
  • 23.3x more texture fill rate: 316.4 GTexel / s vs 13.6 GTexel / s
  • 16.7x more pipelines: 3200 vs 192
  • 31x better floating-point performance: 10,125 gflops vs 326.4 gflops
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 16 nm vs 28 nm
  • 5x more maximum memory size: 5 GB vs 1 GB
  • 5.6x more memory clock speed: 10008 MHz vs 1782 MHz
Launch date 12 February 2018 vs 28 June 2013
Core clock speed 1481 MHz vs 850 MHz
Texture fill rate 316.4 GTexel / s vs 13.6 GTexel / s
Pipelines 3200 vs 192
Floating-point performance 10,125 gflops vs 326.4 gflops
Manufacturing process technology 16 nm vs 28 nm
Maximum memory size 5 GB vs 1 GB
Memory clock speed 10008 MHz vs 1782 MHz

Reasons to consider the NVIDIA GRID K140Q

  • Around 92% lower typical power consumption: 130 Watt vs 250 Watt
Thermal Design Power (TDP) 130 Watt vs 250 Watt

Compare benchmarks

GPU 1: NVIDIA P102-100
GPU 2: NVIDIA GRID K140Q

Name NVIDIA P102-100 NVIDIA GRID K140Q
Geekbench - OpenCL 64572
PassMark - G3D Mark 728
PassMark - G2D Mark 457

Compare specifications (specs)

NVIDIA P102-100 NVIDIA GRID K140Q

Essentials

Architecture Pascal Kepler
Code name GP102 GK107
Launch date 12 February 2018 28 June 2013
Launch price (MSRP) $599 $125
Place in performance rating 324 323
Type Desktop Workstation

Technical info

Boost clock speed 1582 MHz
Core clock speed 1481 MHz 850 MHz
Floating-point performance 10,125 gflops 326.4 gflops
Manufacturing process technology 16 nm 28 nm
Pipelines 3200 192
Texture fill rate 316.4 GTexel / s 13.6 GTexel / s
Thermal Design Power (TDP) 250 Watt 130 Watt
Transistor count 11,800 million 1,270 million

Video outputs and ports

Display Connectors No outputs No outputs

Compatibility, dimensions and requirements

Interface PCIe 3.0 x4 PCIe 3.0 x16
Length 267 mm
Supplementary power connectors 2x 8-pin

API support

DirectX 12.0 (12_1) 12.0 (11_0)
OpenGL 4.6 4.6

Memory

Maximum RAM amount 5 GB 1 GB
Memory bandwidth 400.3 GB / s 28.51 GB / s
Memory bus width 320 Bit 128 Bit
Memory clock speed 10008 MHz 1782 MHz
Memory type GDDR5X DDR3