AMD EPYC 7302P vs Intel Xeon Platinum 8170
Comparative analysis of AMD EPYC 7302P and Intel Xeon Platinum 8170 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD EPYC 7302P
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm, 14 nm vs 14 nm
- 5.3x more maximum memory size: 4 TB vs 768 GB
- Around 6% lower typical power consumption: 155 Watt vs 165 Watt
Manufacturing process technology | 7 nm, 14 nm vs 14 nm |
Maximum memory size | 4 TB vs 768 GB |
Thermal Design Power (TDP) | 155 Watt vs 165 Watt |
Reasons to consider the Intel Xeon Platinum 8170
- 10 more cores, run more applications at once: 26 vs 16
- 20 more threads: 52 vs 32
- Around 12% higher clock speed: 3.70 GHz vs 3.3 GHz
Number of cores | 26 vs 16 |
Number of threads | 52 vs 32 |
Maximum frequency | 3.70 GHz vs 3.3 GHz |
Compare benchmarks
CPU 1: AMD EPYC 7302P
CPU 2: Intel Xeon Platinum 8170
Name | AMD EPYC 7302P | Intel Xeon Platinum 8170 |
---|---|---|
PassMark - Single thread mark | 1870 | |
PassMark - CPU mark | 32612 | |
Geekbench 4 - Single Core | 4221 | |
Geekbench 4 - Multi-Core | 33793 |
Compare specifications (specs)
AMD EPYC 7302P | Intel Xeon Platinum 8170 | |
---|---|---|
Essentials |
||
Architecture codename | Zen 2 | Skylake |
Launch date | 7 Aug 2019 | Q3'17 |
Launch price (MSRP) | $825 | |
OPN PIB | 100-100000049WOF | |
OPN Tray | 100-000000049 | |
Place in performance rating | 801 | 4 |
Vertical segment | Server | Server |
Processor Number | 8170 | |
Series | Intel® Xeon® Scalable Processors | |
Status | Launched | |
Performance |
||
Base frequency | 3.0 GHz | 2.10 GHz |
L1 cache | 1 MB | |
L2 cache | 8 MB | |
L3 cache | 128 MB | |
Manufacturing process technology | 7 nm, 14 nm | 14 nm |
Maximum frequency | 3.3 GHz | 3.70 GHz |
Number of cores | 16 | 26 |
Number of threads | 32 | 52 |
Unlocked | ||
Maximum core temperature | 89°C | |
Number of Ultra Path Interconnect (UPI) Links | 3 | |
Memory |
||
ECC memory support | ||
Max memory channels | 8 | 6 |
Maximum memory bandwidth | 190.7 GB/s | |
Maximum memory size | 4 TB | 768 GB |
Supported memory types | DDR4-3200 | DDR4-2666 |
Supported memory frequency | 2666 MHz | |
Compatibility |
||
Socket Count | 1P | |
Sockets supported | SP3 | FCLGA3647 |
Thermal Design Power (TDP) | 155 Watt | 165 Watt |
Low Halogen Options Available | ||
Package Size | 76.0mm x 56.5mm | |
Peripherals |
||
Max number of PCIe lanes | 128 | 48 |
PCI Express revision | 4.0 | 3.0 |
PCIe configurations | x16, x8 | |
Scalability | S8S | |
Advanced Technologies |
||
AMD SenseMI | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Intel® AES New Instructions | ||
Enhanced Intel SpeedStep® technology | ||
Instruction set extensions | Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512 | |
Intel 64 | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® Volume Management Device (VMD) | ||
Intel® vPro™ Platform Eligibility | ||
Number of AVX-512 FMA Units | 2 | |
Speed Shift technology | ||
Virtualization |
||
AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Run Sure Technology | ||
Intel® Trusted Execution technology (TXT) | ||
Mode-based Execute Control (MBE) |