AMD EPYC 7302P vs Intel Xeon Platinum 8170

Comparative analysis of AMD EPYC 7302P and Intel Xeon Platinum 8170 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

AMD EPYC 7302P

Intel Xeon Platinum 8170

Differences

Reasons to consider the AMD EPYC 7302P

A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm, 14 nm vs 14 nm
5.3x more maximum memory size: 4 TB vs 768 GB
Around 6% lower typical power consumption: 155 Watt vs 165 Watt

Manufacturing process technology	7 nm, 14 nm vs 14 nm
Maximum memory size	4 TB vs 768 GB
Thermal Design Power (TDP)	155 Watt vs 165 Watt

Reasons to consider the Intel Xeon Platinum 8170

10 more cores, run more applications at once: 26 vs 16
20 more threads: 52 vs 32
Around 12% higher clock speed: 3.70 GHz vs 3.3 GHz

Number of cores	26 vs 16
Number of threads	52 vs 32
Maximum frequency	3.70 GHz vs 3.3 GHz

Compare benchmarks

CPU 1: AMD EPYC 7302P
CPU 2: Intel Xeon Platinum 8170

Name	AMD EPYC 7302P	Intel Xeon Platinum 8170
PassMark - Single thread mark	1893
PassMark - CPU mark	32690
Geekbench 4 - Single Core		4221
Geekbench 4 - Multi-Core		33793

Compare specifications (specs)

	AMD EPYC 7302P	Intel Xeon Platinum 8170
Essentials
Architecture codename	Zen 2	Skylake
Launch date	7 Aug 2019	Q3'17
Launch price (MSRP)	$825
OPN PIB	100-100000049WOF
OPN Tray	100-000000049
Place in performance rating	947	1
Vertical segment	Server	Server
Processor Number		8170
Series		Intel® Xeon® Scalable Processors
Status		Launched
Performance
Base frequency	3.0 GHz	2.10 GHz
L1 cache	1 MB
L2 cache	8 MB
L3 cache	128 MB
Manufacturing process technology	7 nm, 14 nm	14 nm
Maximum frequency	3.3 GHz	3.70 GHz
Number of cores	16	26
Number of threads	32	52
Unlocked
Maximum core temperature		89°C
Number of Ultra Path Interconnect (UPI) Links		3
Memory
ECC memory support
Max memory channels	8	6
Maximum memory bandwidth	190.7 GB/s
Maximum memory size	4 TB	768 GB
Supported memory types	DDR4-3200	DDR4-2666
Supported memory frequency		2666 MHz
Compatibility
Socket Count	1P
Sockets supported	SP3	FCLGA3647
Thermal Design Power (TDP)	155 Watt	165 Watt
Low Halogen Options Available
Package Size		76.0mm x 56.5mm
Peripherals
Max number of PCIe lanes	128	48
PCI Express revision	4.0	3.0
PCIe configurations	x16, x8
Scalability		S8S
Advanced Technologies
AMD SenseMI
Fused Multiply-Add 3 (FMA3)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
Enhanced Intel SpeedStep® technology
Instruction set extensions		Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Intel 64
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Number of AVX-512 FMA Units		2
Speed Shift technology
Virtualization
AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Security & Reliability
Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)