AMD EPYC 7302P vs Intel Xeon Platinum 8170

Comparative analysis of AMD EPYC 7302P and Intel Xeon Platinum 8170 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the AMD EPYC 7302P

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm, 14 nm vs 14 nm
  • 5.3x more maximum memory size: 4 TB vs 768 GB
  • Around 6% lower typical power consumption: 155 Watt vs 165 Watt
Manufacturing process technology 7 nm, 14 nm vs 14 nm
Maximum memory size 4 TB vs 768 GB
Thermal Design Power (TDP) 155 Watt vs 165 Watt

Reasons to consider the Intel Xeon Platinum 8170

  • 10 more cores, run more applications at once: 26 vs 16
  • 20 more threads: 52 vs 32
  • Around 12% higher clock speed: 3.70 GHz vs 3.3 GHz
Number of cores 26 vs 16
Number of threads 52 vs 32
Maximum frequency 3.70 GHz vs 3.3 GHz

Compare benchmarks

CPU 1: AMD EPYC 7302P
CPU 2: Intel Xeon Platinum 8170

Name AMD EPYC 7302P Intel Xeon Platinum 8170
PassMark - Single thread mark 2248
PassMark - CPU mark 30994
Geekbench 4 - Single Core 4221
Geekbench 4 - Multi-Core 33793

Compare specifications (specs)

AMD EPYC 7302P Intel Xeon Platinum 8170

Essentials

Architecture codename Zen 2 Skylake
Launch date 7 Aug 2019 Q3'17
Launch price (MSRP) $825
OPN PIB 100-100000049WOF
OPN Tray 100-000000049
Place in performance rating 15 2
Vertical segment Server Server
Processor Number 8170
Series Intel® Xeon® Scalable Processors
Status Launched

Performance

Base frequency 3.0 GHz 2.10 GHz
L1 cache 1 MB
L2 cache 8 MB
L3 cache 128 MB
Manufacturing process technology 7 nm, 14 nm 14 nm
Maximum frequency 3.3 GHz 3.70 GHz
Number of cores 16 26
Number of threads 32 52
Unlocked
Maximum core temperature 89°C
Number of Ultra Path Interconnect (UPI) Links 3

Memory

ECC memory support
Max memory channels 8 6
Maximum memory bandwidth 190.7 GB/s
Maximum memory size 4 TB 768 GB
Supported memory types DDR4-3200 DDR4-2666
Supported memory frequency 2666 MHz

Compatibility

Socket Count 1P
Sockets supported SP3 FCLGA3647
Thermal Design Power (TDP) 155 Watt 165 Watt
Low Halogen Options Available
Package Size 76.0mm x 56.5mm

Peripherals

Max number of PCIe lanes 128 48
PCI Express revision 4.0 3.0
PCIe configurations x16, x8
Scalability S8S

Advanced Technologies

AMD SenseMI
Fused Multiply-Add 3 (FMA3)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
Enhanced Intel SpeedStep® technology
Instruction set extensions Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Intel 64
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Number of AVX-512 FMA Units 2
Speed Shift technology

Virtualization

AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

Security & Reliability

Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)