AMD Ryzen 9 6900HS vs Intel Core i3-330M
Comparative analysis of AMD Ryzen 9 6900HS and Intel Core i3-330M processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals, Advanced Technologies, Virtualization, Graphics interfaces, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s).
Differences
Reasons to consider the AMD Ryzen 9 6900HS
- CPU is newer: launch date 11 year(s) 11 month(s) later
- 6 more cores, run more applications at once: 8 vs 2
- 12 more threads: 16 vs 4
- Around 130% higher clock speed: 4.9 GHz vs 2.13 GHz
- Around 6% higher maximum core temperature: 95 °C vs 90°C for rPGA, 105°C for BGA
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 6 nm vs 32 nm
- 8x more L2 cache, more data can be stored in the L2 cache for quick access later
- 5.3x more L3 cache, more data can be stored in the L3 cache for quick access later
- 4x better performance in PassMark - Single thread mark: 3256 vs 813
- 22.7x better performance in PassMark - CPU mark: 23303 vs 1027
Specifications (specs) | |
Launch date | Jan 2022 vs 10 January 2010 |
Number of cores | 8 vs 2 |
Number of threads | 16 vs 4 |
Maximum frequency | 4.9 GHz vs 2.13 GHz |
Maximum core temperature | 95 °C vs 90°C for rPGA, 105°C for BGA |
Manufacturing process technology | 6 nm vs 32 nm |
L2 cache | 4 MB vs 512 KB |
L3 cache | 16 MB vs 3072 KB |
Benchmarks | |
PassMark - Single thread mark | 3256 vs 813 |
PassMark - CPU mark | 23303 vs 1027 |
Compare benchmarks
CPU 1: AMD Ryzen 9 6900HS
CPU 2: Intel Core i3-330M
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen 9 6900HS | Intel Core i3-330M |
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PassMark - Single thread mark | 3256 | 813 |
PassMark - CPU mark | 23303 | 1027 |
3DMark Fire Strike - Physics Score | 6904 | |
Geekbench 4 - Single Core | 317 | |
Geekbench 4 - Multi-Core | 689 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 1.641 |
Compare specifications (specs)
AMD Ryzen 9 6900HS | Intel Core i3-330M | |
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Essentials |
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Architecture codename | Zen 3+ | Arrandale |
Launch date | Jan 2022 | 10 January 2010 |
Place in performance rating | 610 | 2972 |
Vertical segment | Mobile | Mobile |
Launch price (MSRP) | $49 | |
Price now | $48.56 | |
Processor Number | i3-330M | |
Series | Legacy Intel® Core™ Processors | |
Status | Discontinued | |
Value for money (0-100) | 10.85 | |
Performance |
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Base frequency | 3.3 GHz | 2.13 GHz |
Die size | 208 mm² | 81 mm2 |
L1 cache | 512 KB | |
L2 cache | 4 MB | 512 KB |
L3 cache | 16 MB | 3072 KB |
Manufacturing process technology | 6 nm | 32 nm |
Maximum core temperature | 95 °C | 90°C for rPGA, 105°C for BGA |
Maximum frequency | 4.9 GHz | 2.13 GHz |
Number of cores | 8 | 2 |
Number of threads | 16 | 4 |
Unlocked | ||
64 bit support | ||
Bus Speed | 2.5 GT/s DMI | |
Front-side bus (FSB) | 2500 MHz | |
Transistor count | 382 million | |
Memory |
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ECC memory support | ||
Max memory channels | 2 | 2 |
Supported memory types | DDR5-4800 | DDR3 800/1066 |
Maximum memory bandwidth | 17.1 GB/s | |
Maximum memory size | 8 GB | |
Graphics |
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Graphics max frequency | 2400 MHz | 667 MHz |
Graphics base frequency | 500 MHz | |
Graphics max dynamic frequency | 667 MHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Processor graphics | Intel HD Graphics | |
Compatibility |
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Sockets supported | FP7 | BGA1288, PGA988 |
Thermal Design Power (TDP) | 35 Watt | 35 Watt |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | rPGA 37.5mmx 37.5mm, BGA 34mmx28mm | |
Peripherals |
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Max number of PCIe lanes | 20 | 16 |
PCI Express revision | 4.0 | 2.0 |
PCIe configurations | 1x16 | |
Advanced Technologies |
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AMD SenseMI | ||
AMD StoreMI technology | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Intel® AES New Instructions | ||
Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
Intel 64 | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 36-bit | |
Thermal Monitoring | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics interfaces |
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Number of displays supported | 2 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) |