Intel Celeron Dual-Core T3000 vs Intel Celeron M 560

Comparative analysis of Intel Celeron Dual-Core T3000 and Intel Celeron M 560 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Celeron Dual-Core T3000

Intel Celeron M 560

Differences

Reasons to consider the Intel Celeron Dual-Core T3000

CPU is newer: launch date 1 year(s) 0 month(s) later
1 more cores, run more applications at once: 2 vs 1
1 more threads: 2 vs 1
A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm

Launch date	1 May 2009 vs 1 May 2008
Number of cores	2 vs 1
Number of threads	2 vs 1
Manufacturing process technology	45 nm vs 65 nm

Reasons to consider the Intel Celeron M 560

Around 18% higher clock speed: 2.13 GHz vs 1.8 GHz
Around 13% lower typical power consumption: 31 Watt vs 35 Watt

Maximum frequency	2.13 GHz vs 1.8 GHz
Thermal Design Power (TDP)	31 Watt vs 35 Watt

Compare benchmarks

CPU 1: Intel Celeron Dual-Core T3000
CPU 2: Intel Celeron M 560

Name	Intel Celeron Dual-Core T3000	Intel Celeron M 560
PassMark - Single thread mark	728
PassMark - CPU mark	1084
Geekbench 4 - Single Core	219
Geekbench 4 - Multi-Core	377

Compare specifications (specs)

	Intel Celeron Dual-Core T3000	Intel Celeron M 560
Essentials
Architecture codename	Penryn-1M	Merom
Launch date	1 May 2009	1 May 2008
Place in performance rating	3018	not rated
Series	Intel Celeron Dual-Core	Legacy Intel® Celeron® Processor
Vertical segment	Laptop	Mobile
Processor Number		560
Status		Discontinued
Performance
64 bit support
Die size	107 mm	143 mm2
Front-side bus (FSB)	800 MHz	533 MHz
L1 cache	64 KB	64 KB
L2 cache	1024 KB	1024 KB
Manufacturing process technology	45 nm	65 nm
Maximum frequency	1.8 GHz	2.13 GHz
Number of cores	2	1
Number of threads	2	1
Transistor count	410 Million	291 million
Base frequency		2.13 GHz
Bus Speed		533 MHz FSB
Maximum core temperature		100°C
VID voltage range		0.95V-1.30V
Compatibility
Sockets supported	P (478)	PPGA478
Thermal Design Power (TDP)	35 Watt	31 Watt
Low Halogen Options Available
Package Size		35mm x 35mm
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Virtualization
Intel® Virtualization Technology (VT-x)