Intel Core 2 Duo L7300 vs Intel Celeron Dual-Core T3500
Comparative analysis of Intel Core 2 Duo L7300 and Intel Celeron Dual-Core T3500 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core 2 Duo L7300
- 2.1x lower typical power consumption: 17 Watt vs 35 Watt
| Thermal Design Power (TDP) | 17 Watt vs 35 Watt |
Reasons to consider the Intel Celeron Dual-Core T3500
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
- Around 53% better performance in PassMark - Single thread mark: 843 vs 551
- 2.4x better performance in PassMark - CPU mark: 1276 vs 536
| Specifications (specs) | |
| Manufacturing process technology | 45 nm vs 65 nm |
| Benchmarks | |
| PassMark - Single thread mark | 843 vs 551 |
| PassMark - CPU mark | 1276 vs 536 |
Compare benchmarks
CPU 1: Intel Core 2 Duo L7300
CPU 2: Intel Celeron Dual-Core T3500
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Core 2 Duo L7300 | Intel Celeron Dual-Core T3500 |
|---|---|---|
| PassMark - Single thread mark | 551 | 843 |
| PassMark - CPU mark | 536 | 1276 |
| Geekbench 4 - Single Core | 234 | |
| Geekbench 4 - Multi-Core | 412 |
Compare specifications (specs)
| Intel Core 2 Duo L7300 | Intel Celeron Dual-Core T3500 | |
|---|---|---|
Essentials |
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| Architecture codename | Merom | Penryn |
| Launch date | Q2'07 | 26 September 2010 |
| Place in performance rating | 2917 | 2907 |
| Processor Number | L7300 | T3500 |
| Series | Legacy Intel® Core™ Processors | Legacy Intel® Celeron® Processor |
| Status | Discontinued | Discontinued |
| Vertical segment | Mobile | Mobile |
| Launch price (MSRP) | $80 | |
Performance |
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| 64 bit support | ||
| Base frequency | 1.40 GHz | 2.10 GHz |
| Bus Speed | 800 MHz FSB | 800 MHz FSB |
| Die size | 143 mm2 | 107 mm2 |
| Manufacturing process technology | 65 nm | 45 nm |
| Maximum core temperature | 100°C | |
| Number of cores | 2 | 2 |
| Transistor count | 291 million | 410 million |
| VID voltage range | 0.975V-1.062V | |
| Front-side bus (FSB) | 800 MHz | |
| L1 cache | 128 KB | |
| L2 cache | 1024 KB | |
| Maximum frequency | 2.1 GHz | |
| Number of threads | 2 | |
Compatibility |
||
| Low Halogen Options Available | ||
| Package Size | 35mm x 35mm | |
| Sockets supported | PBGA479 | PGA478 |
| Thermal Design Power (TDP) | 17 Watt | 35 Watt |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
