Intel Core i3-3217UE vs VIA Nano U2250

Comparative analysis of Intel Core i3-3217UE and VIA Nano U2250 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Core i3-3217UE

VIA Nano U2250

Differences

Reasons to consider the Intel Core i3-3217UE

CPU is newer: launch date 3 year(s) 6 month(s) later
1 more cores, run more applications at once: 2 vs 1
3 more threads: 4 vs 1
Around 7% higher clock speed: 1.6 GHz vs 1.5 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm

Launch date	August 2012 vs 1 January 2009
Number of cores	2 vs 1
Number of threads	4 vs 1
Maximum frequency	1.6 GHz vs 1.5 GHz
Manufacturing process technology	22 nm vs 65 nm

Reasons to consider the VIA Nano U2250

2x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 70% lower typical power consumption: 10 Watt vs 17 Watt

L2 cache	1024 KB vs 256 KB (per core)
Thermal Design Power (TDP)	10 Watt vs 17 Watt

Compare benchmarks

CPU 1: Intel Core i3-3217UE
CPU 2: VIA Nano U2250

Name	Intel Core i3-3217UE	VIA Nano U2250
PassMark - Single thread mark	711
PassMark - CPU mark	1362

Compare specifications (specs)

	Intel Core i3-3217UE	VIA Nano U2250
Essentials
Architecture codename	Ivy Bridge	Isaiah
Launch date	August 2012	1 January 2009
Place in performance rating	2674	not rated
Processor Number	i3-3217UE
Series	Legacy Intel® Core™ Processors	VIA Nano
Status	Launched
Vertical segment	Embedded	Laptop
Performance
64 bit support
Base frequency	1.60 GHz
Bus Speed	5 GT/s DMI
Die size	118 mm
L1 cache	64 KB (per core)
L2 cache	256 KB (per core)	1024 KB
L3 cache	3072 KB (shared)
Manufacturing process technology	22 nm	65 nm
Maximum core temperature	105°C
Maximum frequency	1.6 GHz	1.5 GHz
Number of cores	2	1
Number of threads	4	1
Front-side bus (FSB)		800 MHz
Memory
ECC memory support
Max memory channels	2
Maximum memory bandwidth	25.6 GB/s
Maximum memory size	16 GB
Supported memory types	DDR3/DDR3L 1333/1600
Graphics
Graphics base frequency	350 MHz
Graphics max dynamic frequency	900 MHz
Graphics max frequency	900 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel® HD Graphics 4000
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported	3
SDVO
Wireless Display (WiDi) support
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	31mm x 24mm
Sockets supported	FCBGA1023	NanoBGA2
Thermal Design Power (TDP)	17 Watt	10 Watt
Peripherals
Max number of PCIe lanes	1
PCI Express revision	2.0
PCIe configurations	1x16 2x8 1x8 2x4
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)