Intel Pentium G3320TE vs AMD Phenom II X2 P650

Comparative analysis of Intel Pentium G3320TE and AMD Phenom II X2 P650 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Pentium G3320TE

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
  • Around 33% better performance in PassMark - Single thread mark: 1312 vs 985
  • Around 68% better performance in PassMark - CPU mark: 1570 vs 933
Specifications (specs)
Manufacturing process technology 22 nm vs 45 nm
Benchmarks
PassMark - Single thread mark 1312 vs 985
PassMark - CPU mark 1570 vs 933

Reasons to consider the AMD Phenom II X2 P650

  • Around 39% higher maximum core temperature: 100°C vs 72°C
Maximum core temperature 100°C vs 72°C

Compare benchmarks

CPU 1: Intel Pentium G3320TE
CPU 2: AMD Phenom II X2 P650

PassMark - Single thread mark
CPU 1
CPU 2
1312
985
PassMark - CPU mark
CPU 1
CPU 2
1570
933
Name Intel Pentium G3320TE AMD Phenom II X2 P650
PassMark - Single thread mark 1312 985
PassMark - CPU mark 1570 933
Geekbench 4 - Single Core 1527
Geekbench 4 - Multi-Core 2644

Compare specifications (specs)

Intel Pentium G3320TE AMD Phenom II X2 P650

Essentials

Architecture codename Haswell Champlain
Launch date Q3'13 19 October 2010
Place in performance rating 1927 1914
Processor Number G3320TE
Series Intel® Pentium® Processor G Series AMD Phenom II Dual-Core Mobile Processors
Status Launched
Vertical segment Embedded Laptop
Family AMD Phenom
OPN Tray HMP650SGR23GM

Performance

64 bit support
Base frequency 2.30 GHz 2.6 GHz
Bus Speed 5 GT/s DMI2
Manufacturing process technology 22 nm 45 nm
Maximum core temperature 72°C 100°C
Number of cores 2 2
Number of QPI Links 1
Number of threads 2 2
Front-side bus (FSB) 3600 MHz
L1 cache 256 KB
L2 cache 2 MB
Maximum frequency 2.8 GHz
Unlocked

Memory

Max memory channels 2
Maximum memory bandwidth 21.3 GB/s
Maximum memory size 32 GB
Supported memory types DDR3-1333, DDR3L-1333 @ 1.5V DDR3

Graphics

Graphics base frequency 350 MHz
Graphics max dynamic frequency 1.00 GHz
Intel® Clear Video HD technology
Intel® Quick Sync Video
Max video memory 1 GB
Processor graphics Intel HD Graphics

Graphics interfaces

DisplayPort
DVI
eDP
HDMI
Number of displays supported 3
VGA

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size 37.5mm x 37.5mm
Sockets supported FCLGA1150 S1
Thermal Design Power (TDP) 35 Watt 35 Watt
Thermal Solution PCG 2013A

Peripherals

Max number of PCIe lanes 16
PCI Express revision 3.0
PCIe configurations Up to 1x16, 2x8, 1x8/2x4

Security & Reliability

Execute Disable Bit (EDB)
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
VirusProtect

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)