Intel Pentium G3320TE vs AMD Phenom II X2 P650

Comparative analysis of Intel Pentium G3320TE and AMD Phenom II X2 P650 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Pentium G3320TE

AMD Phenom II X2 P650

Differences

Reasons to consider the Intel Pentium G3320TE

A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
Around 33% better performance in PassMark - Single thread mark: 1312 vs 985
Around 68% better performance in PassMark - CPU mark: 1570 vs 933

Specifications (specs)
Manufacturing process technology	22 nm vs 45 nm
Benchmarks
PassMark - Single thread mark	1312 vs 985
PassMark - CPU mark	1570 vs 933

Reasons to consider the AMD Phenom II X2 P650

Around 39% higher maximum core temperature: 100°C vs 72°C

Maximum core temperature	100°C vs 72°C

Compare benchmarks

CPU 1: Intel Pentium G3320TE
CPU 2: AMD Phenom II X2 P650

PassMark - Single thread mark

CPU 1

CPU 2

1312

985

PassMark - CPU mark

CPU 1

CPU 2

1570

933

Name	Intel Pentium G3320TE	AMD Phenom II X2 P650
PassMark - Single thread mark	1312	985
PassMark - CPU mark	1570	933
Geekbench 4 - Single Core		1527
Geekbench 4 - Multi-Core		2644

Compare specifications (specs)

	Intel Pentium G3320TE	AMD Phenom II X2 P650
Essentials
Architecture codename	Haswell	Champlain
Launch date	Q3'13	19 October 2010
Place in performance rating	1928	1914
Processor Number	G3320TE
Series	Intel® Pentium® Processor G Series	AMD Phenom II Dual-Core Mobile Processors
Status	Launched
Vertical segment	Embedded	Laptop
Family		AMD Phenom
OPN Tray		HMP650SGR23GM
Performance
64 bit support
Base frequency	2.30 GHz	2.6 GHz
Bus Speed	5 GT/s DMI2
Manufacturing process technology	22 nm	45 nm
Maximum core temperature	72°C	100°C
Number of cores	2	2
Number of QPI Links	1
Number of threads	2	2
Front-side bus (FSB)		3600 MHz
L1 cache		256 KB
L2 cache		2 MB
Maximum frequency		2.8 GHz
Unlocked
Memory
Max memory channels	2
Maximum memory bandwidth	21.3 GB/s
Maximum memory size	32 GB
Supported memory types	DDR3-1333, DDR3L-1333 @ 1.5V	DDR3
Graphics
Graphics base frequency	350 MHz
Graphics max dynamic frequency	1.00 GHz
Intel® Clear Video HD technology
Intel® Quick Sync Video
Max video memory	1 GB
Processor graphics	Intel HD Graphics
Graphics interfaces
DisplayPort
DVI
eDP
HDMI
Number of displays supported	3
VGA
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	37.5mm x 37.5mm
Sockets supported	FCLGA1150	S1
Thermal Design Power (TDP)	35 Watt	35 Watt
Thermal Solution	PCG 2013A
Peripherals
Max number of PCIe lanes	16
PCI Express revision	3.0
PCIe configurations	Up to 1x16, 2x8, 1x8/2x4
Security & Reliability
Execute Disable Bit (EDB)
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
VirusProtect
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)