Intel Pentium G3320TE vs AMD Phenom II X2 X620 BE
Comparative analysis of Intel Pentium G3320TE and AMD Phenom II X2 X620 BE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Pentium G3320TE
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
- Around 29% lower typical power consumption: 35 Watt vs 45 Watt
- Around 24% better performance in PassMark - CPU mark: 1570 vs 1262
Specifications (specs) | |
Manufacturing process technology | 22 nm vs 45 nm |
Thermal Design Power (TDP) | 35 Watt vs 45 Watt |
Benchmarks | |
PassMark - CPU mark | 1570 vs 1262 |
Reasons to consider the AMD Phenom II X2 X620 BE
- Around 2% better performance in PassMark - Single thread mark: 1339 vs 1312
Benchmarks | |
PassMark - Single thread mark | 1339 vs 1312 |
Compare benchmarks
CPU 1: Intel Pentium G3320TE
CPU 2: AMD Phenom II X2 X620 BE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Pentium G3320TE | AMD Phenom II X2 X620 BE |
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PassMark - Single thread mark | 1312 | 1339 |
PassMark - CPU mark | 1570 | 1262 |
Compare specifications (specs)
Intel Pentium G3320TE | AMD Phenom II X2 X620 BE | |
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Essentials |
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Architecture codename | Haswell | Champlain |
Launch date | Q3'13 | 12 May 2010 |
Place in performance rating | 1927 | 1926 |
Processor Number | G3320TE | |
Series | Intel® Pentium® Processor G Series | 2x AMD Phenom II |
Status | Launched | |
Vertical segment | Embedded | Laptop |
Performance |
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64 bit support | ||
Base frequency | 2.30 GHz | |
Bus Speed | 5 GT/s DMI2 | |
Manufacturing process technology | 22 nm | 45 nm |
Maximum core temperature | 72°C | |
Number of cores | 2 | 2 |
Number of QPI Links | 1 | |
Number of threads | 2 | 2 |
Front-side bus (FSB) | 3600 MHz | |
L2 cache | 2048 KB | |
Maximum frequency | 3.1 GHz | |
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 21.3 GB/s | |
Maximum memory size | 32 GB | |
Supported memory types | DDR3-1333, DDR3L-1333 @ 1.5V | |
Graphics |
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Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.00 GHz | |
Intel® Clear Video HD technology | ||
Intel® Quick Sync Video | ||
Max video memory | 1 GB | |
Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
VGA | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 37.5mm x 37.5mm | |
Sockets supported | FCLGA1150 | S1 |
Thermal Design Power (TDP) | 35 Watt | 45 Watt |
Thermal Solution | PCG 2013A | |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 3.0 | |
PCIe configurations | Up to 1x16, 2x8, 1x8/2x4 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |