Intel Xeon Platinum 8170 vs AMD Opteron 4334

Comparative analysis of Intel Xeon Platinum 8170 and AMD Opteron 4334 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Xeon Platinum 8170

  • 20 more cores, run more applications at once: 26 vs 6
  • 46 more threads: 52 vs 6
  • Around 6% higher clock speed: 3.70 GHz vs 3.5 GHz
  • Around 31% higher maximum core temperature: 89°C vs 67.70°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 32 nm
Number of cores 26 vs 6
Number of threads 52 vs 6
Maximum frequency 3.70 GHz vs 3.5 GHz
Maximum core temperature 89°C vs 67.70°C
Manufacturing process technology 14 nm vs 32 nm

Reasons to consider the AMD Opteron 4334

  • Around 74% lower typical power consumption: 95 Watt vs 165 Watt
Thermal Design Power (TDP) 95 Watt vs 165 Watt

Compare benchmarks

CPU 1: Intel Xeon Platinum 8170
CPU 2: AMD Opteron 4334

Name Intel Xeon Platinum 8170 AMD Opteron 4334
Geekbench 4 - Single Core 4221
Geekbench 4 - Multi-Core 33793
PassMark - Single thread mark 1208
PassMark - CPU mark 6099

Compare specifications (specs)

Intel Xeon Platinum 8170 AMD Opteron 4334

Essentials

Architecture codename Skylake Seoul
Launch date Q3'17 n/d
Place in performance rating 1 10
Processor Number 8170
Series Intel® Xeon® Scalable Processors AMD Opteron 4300 Series Processor
Status Launched
Vertical segment Server Server
Family AMD Opteron
OPN Tray OS4334WLU6KHK

Performance

Base frequency 2.10 GHz 3.1 GHz
Manufacturing process technology 14 nm 32 nm
Maximum core temperature 89°C 67.70°C
Maximum frequency 3.70 GHz 3.5 GHz
Number of cores 26 6
Number of threads 52 6
Number of Ultra Path Interconnect (UPI) Links 3
64 bit support
Die size 315 mm
L1 cache 288 KB
L2 cache 6 MB
L3 cache 8 MB
Transistor count 1200 million
Unlocked

Memory

Max memory channels 6
Maximum memory size 768 GB
Supported memory frequency 2666 MHz 2000 MHz
Supported memory types DDR4-2666 DDR3

Compatibility

Low Halogen Options Available
Package Size 76.0mm x 56.5mm
Sockets supported FCLGA3647 C32
Thermal Design Power (TDP) 165 Watt 95 Watt
Max number of CPUs in a configuration 2

Peripherals

Max number of PCIe lanes 48
PCI Express revision 3.0
Scalability S8S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Instruction set extensions Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Number of AVX-512 FMA Units 2
Speed Shift technology
Fused Multiply-Add (FMA)
Intel® Advanced Vector Extensions (AVX)

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)