AMD FirePro M8900 vs NVIDIA GeForce GTX 260

Comparative analysis of AMD FirePro M8900 and NVIDIA GeForce GTX 260 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: Geekbench - OpenCL, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), PassMark - G3D Mark, PassMark - G2D Mark, GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

 

Differences

Reasons to consider the AMD FirePro M8900

  • Videocard is newer: launch date 2 year(s) 9 month(s) later
  • 5x more pipelines: 960 vs 192
  • 2.7x better floating-point performance: 1,305.6 gflops vs 476.9 gflops
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 40 nm vs 65 nm
  • 2.4x lower typical power consumption: 75 Watt vs 182 Watt
  • 2.3x more maximum memory size: 2 GB vs 896 MB
  • 3.6x more memory clock speed: 3600 MHz vs 999 MHz
  • Around 22% better performance in CompuBench 1.5 Desktop - Face Detection (mPixels/s): 10.529 vs 8.664
  • Around 59% better performance in CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s): 760.858 vs 477.327
  • Around 5% better performance in CompuBench 1.5 Desktop - Video Composition (Frames/s): 26.149 vs 24.906
  • 3.7x better performance in CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s): 108.525 vs 29.525
Specifications (specs)
Launch date 12 April 2011 vs 16 June 2008
Pipelines 960 vs 192
Floating-point performance 1,305.6 gflops vs 476.9 gflops
Manufacturing process technology 40 nm vs 65 nm
Thermal Design Power (TDP) 75 Watt vs 182 Watt
Maximum memory size 2 GB vs 896 MB
Memory clock speed 3600 MHz vs 999 MHz
Benchmarks
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 10.529 vs 8.664
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 760.858 vs 477.327
CompuBench 1.5 Desktop - Video Composition (Frames/s) 26.149 vs 24.906
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 108.525 vs 29.525

Reasons to consider the NVIDIA GeForce GTX 260

  • Around 83% higher core clock speed: 1242 MHz vs 680 MHz
  • Around 13% higher texture fill rate: 36.9 billion / sec vs 32.6 GTexel / s
  • Around 4% better performance in Geekbench - OpenCL: 19512 vs 18738
Specifications (specs)
Core clock speed 1242 MHz vs 680 MHz
Texture fill rate 36.9 billion / sec vs 32.6 GTexel / s
Benchmarks
Geekbench - OpenCL 19512 vs 18738

Compare benchmarks

GPU 1: AMD FirePro M8900
GPU 2: NVIDIA GeForce GTX 260

Geekbench - OpenCL
GPU 1
GPU 2
18738
19512
CompuBench 1.5 Desktop - Face Detection (mPixels/s)
GPU 1
GPU 2
10.529
8.664
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)
GPU 1
GPU 2
760.858
477.327
CompuBench 1.5 Desktop - Video Composition (Frames/s)
GPU 1
GPU 2
26.149
24.906
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)
GPU 1
GPU 2
108.525
29.525
Name AMD FirePro M8900 NVIDIA GeForce GTX 260
Geekbench - OpenCL 18738 19512
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 10.529 8.664
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 760.858 477.327
CompuBench 1.5 Desktop - T-Rex (Frames/s) 1.158
CompuBench 1.5 Desktop - Video Composition (Frames/s) 26.149 24.906
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 108.525 29.525
PassMark - G3D Mark 1217
PassMark - G2D Mark 54
GFXBench 4.0 - T-Rex (Frames) 3342
GFXBench 4.0 - T-Rex (Fps) 3342

Compare specifications (specs)

AMD FirePro M8900 NVIDIA GeForce GTX 260

Essentials

Architecture TeraScale 2 Tesla 2.0
Code name Blackcomb GT200
Launch date 12 April 2011 16 June 2008
Place in performance rating 1405 1407
Type Mobile workstation Desktop
Launch price (MSRP) $449
Price now $95.38
Value for money (0-100) 13.70

Technical info

Core clock speed 680 MHz 1242 MHz
Floating-point performance 1,305.6 gflops 476.9 gflops
Manufacturing process technology 40 nm 65 nm
Pipelines 960 192
Texture fill rate 32.6 GTexel / s 36.9 billion / sec
Thermal Design Power (TDP) 75 Watt 182 Watt
Transistor count 1,700 million 1,400 million
CUDA cores 192
Maximum GPU temperature 105 °C

Video outputs and ports

Display Connectors No outputs 2x DVI, 1x S-Video, Dual Link DVIHDTV
Audio input for HDMI S / PDIF
HDMI
Maximum VGA resolution 2048x1536
Multi monitor support

Compatibility, dimensions and requirements

Bus support n / a
Form factor MXM-B
Interface MXM-B (3.0) PCIe 2.0 x16
Laptop size large
Supplementary power connectors None 2x 6-pin
Height 4.376" (111 mm) (11.1 cm)
Length 10.5" (267 mm) (26.7 cm)
SLI options 2-way3-way

API support

DirectX 11.2 (11_0) 10.0
OpenGL 4.4 2.1

Memory

Maximum RAM amount 2 GB 896 MB
Memory bandwidth 115 GB / s 111.9 GB / s
Memory bus width 256 Bit 448 Bit
Memory clock speed 3600 MHz 999 MHz
Memory type GDDR5 GDDR3
Shared memory 0

Technologies

3D Vision
CUDA
SLI