NVIDIA CMP 30HX vs NVIDIA GeForce GTX 480M

Comparative analysis of NVIDIA CMP 30HX and NVIDIA GeForce GTX 480M videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: Geekbench - OpenCL, PassMark - G3D Mark, PassMark - G2D Mark.

NVIDIA CMP 30HX

NVIDIA GeForce GTX 480M

Differences

Reasons to consider the NVIDIA CMP 30HX

Videocard is newer: launch date 10 year(s) 9 month(s) later
Around 80% higher core clock speed: 1530 MHz vs 850 MHz
8401.1x more texture fill rate: 157.1 GTexel/s vs 18.7 billion / sec
4x more pipelines: 1408 vs 352
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 12 nm vs 40 nm
3x more maximum memory size: 6 GB vs 2 GB
Around 46% higher memory clock speed: 1750 MHz, 14 Gbps effective vs 1200 MHz

Launch date	25 Feb 2021 vs 25 May 2010
Core clock speed	1530 MHz vs 850 MHz
Texture fill rate	157.1 GTexel/s vs 18.7 billion / sec
Pipelines	1408 vs 352
Manufacturing process technology	12 nm vs 40 nm
Maximum memory size	6 GB vs 2 GB
Memory clock speed	1750 MHz, 14 Gbps effective vs 1200 MHz

Reasons to consider the NVIDIA GeForce GTX 480M

Around 25% lower typical power consumption: 100 Watt vs 125 Watt

Thermal Design Power (TDP)	100 Watt vs 125 Watt

Compare benchmarks

GPU 1: NVIDIA CMP 30HX
GPU 2: NVIDIA GeForce GTX 480M

Name	NVIDIA CMP 30HX	NVIDIA GeForce GTX 480M
Geekbench - OpenCL	68128
PassMark - G3D Mark		1617
PassMark - G2D Mark		458

Compare specifications (specs)

	NVIDIA CMP 30HX	NVIDIA GeForce GTX 480M
Essentials
Architecture	Turing	Fermi
Code name	TU116	GF100
Launch date	25 Feb 2021	25 May 2010
Place in performance rating	298	296
Type		Laptop
Technical info
Boost clock speed	1785 MHz
Core clock speed	1530 MHz	850 MHz
Manufacturing process technology	12 nm	40 nm
Pipelines	1408	352
Pixel fill rate	85.68 GPixel/s
Texture fill rate	157.1 GTexel/s	18.7 billion / sec
Thermal Design Power (TDP)	125 Watt	100 Watt
Transistor count	6600 million	3,100 million
Floating-point performance		598.4 gflops
Video outputs and ports
Display Connectors	No outputs	No outputs
Maximum VGA resolution		2048x1536
Compatibility, dimensions and requirements
Form factor	Dual-slot
Height	35 mm, 1.4 inches
Interface	PCIe 3.0 x4	MXM-B (3.0)
Length	229 mm, 9 inches
Recommended system power (PSU)	300 Watt
Supplementary power connectors	1x 8-pin	None
Width	111 mm, 4.4 inches
Bus support		PCI-E 2.0
Laptop size		large
SLI options		2-way
API support
DirectX	12 (12_1)	12 API
OpenCL	3.0	1.1
OpenGL	4.6	4.5
Shader Model	6.7
Vulkan
Memory
Maximum RAM amount	6 GB	2 GB
Memory bandwidth	336.0 GB/s	76.8 GB / s
Memory bus width	192 bit	256 Bit
Memory clock speed	1750 MHz, 14 Gbps effective	1200 MHz
Memory type	GDDR6	GDDR5
Shared memory		0
Technologies
3D Vision
CUDA
SLI