NVIDIA Quadro NVS 110M vs ATI FireGL V3200

Comparative analysis of NVIDIA Quadro NVS 110M and ATI FireGL V3200 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark.

 

Differences

Reasons to consider the NVIDIA Quadro NVS 110M

  • Videocard is newer: launch date 1 year(s) 9 month(s) later
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 90 nm vs 130 nm
  • 4.6x lower typical power consumption: 10 Watt vs 46 Watt
  • 4x more maximum memory size: 512 MB vs 128 MB
Launch date 1 June 2006 vs 1 September 2004
Manufacturing process technology 90 nm vs 130 nm
Thermal Design Power (TDP) 10 Watt vs 46 Watt
Maximum memory size 512 MB vs 128 MB

Reasons to consider the ATI FireGL V3200

  • Around 67% higher core clock speed: 500 MHz vs 300 MHz
  • Around 67% higher texture fill rate: 2 GTexel / s vs 1.2 GTexel / s
  • Around 17% higher memory clock speed: 700 MHz vs 600 MHz
  • Around 77% better performance in PassMark - G3D Mark: 85 vs 48
Specifications (specs)
Core clock speed 500 MHz vs 300 MHz
Texture fill rate 2 GTexel / s vs 1.2 GTexel / s
Memory clock speed 700 MHz vs 600 MHz
Benchmarks
PassMark - G3D Mark 85 vs 48

Compare benchmarks

GPU 1: NVIDIA Quadro NVS 110M
GPU 2: ATI FireGL V3200

PassMark - G3D Mark
GPU 1
GPU 2
48
85
PassMark - G2D Mark
GPU 1
GPU 2
236
236
Name NVIDIA Quadro NVS 110M ATI FireGL V3200
PassMark - G3D Mark 48 85
PassMark - G2D Mark 236 236

Compare specifications (specs)

NVIDIA Quadro NVS 110M ATI FireGL V3200

Essentials

Architecture Curie Rage 9
Code name G72 RV380
Launch date 1 June 2006 1 September 2004
Place in performance rating 737 740
Type Mobile workstation Workstation

Technical info

Boost clock speed 300 MHz
Core clock speed 300 MHz 500 MHz
Manufacturing process technology 90 nm 130 nm
Pipelines 4
Texture fill rate 1.2 GTexel / s 2 GTexel / s
Thermal Design Power (TDP) 10 Watt 46 Watt
Transistor count 112 million 75 million

Video outputs and ports

Display Connectors No outputs No outputs

Compatibility, dimensions and requirements

Interface PCIe 1.0 x16 PCIe 1.0 x16
Supplementary power connectors None None

API support

DirectX 9.0c 9.0b
OpenGL 2.1 2.0

Memory

Maximum RAM amount 512 MB 128 MB
Memory bandwidth 4.8 GB / s 11.2 GB / s
Memory bus width 600 Bit 128 Bit
Memory clock speed 600 MHz 700 MHz
Memory type 64 DDR
Shared memory 0

Technologies

CineFX 4.0
Intellisample 4.0
PowerMizer 6.0
UltraShadow II