NVIDIA Quadro NVS 110M vs ATI FireGL V3200

Comparative analysis of NVIDIA Quadro NVS 110M and ATI FireGL V3200 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark.

NVIDIA Quadro NVS 110M

ATI FireGL V3200

Differences

Reasons to consider the NVIDIA Quadro NVS 110M

Videocard is newer: launch date 1 year(s) 9 month(s) later
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 90 nm vs 130 nm
4.6x lower typical power consumption: 10 Watt vs 46 Watt
4x more maximum memory size: 512 MB vs 128 MB

Launch date	1 June 2006 vs 1 September 2004
Manufacturing process technology	90 nm vs 130 nm
Thermal Design Power (TDP)	10 Watt vs 46 Watt
Maximum memory size	512 MB vs 128 MB

Reasons to consider the ATI FireGL V3200

Around 67% higher core clock speed: 500 MHz vs 300 MHz
Around 67% higher texture fill rate: 2 GTexel / s vs 1.2 GTexel / s
Around 17% higher memory clock speed: 700 MHz vs 600 MHz
Around 77% better performance in PassMark - G3D Mark: 85 vs 48

Specifications (specs)
Core clock speed	500 MHz vs 300 MHz
Texture fill rate	2 GTexel / s vs 1.2 GTexel / s
Memory clock speed	700 MHz vs 600 MHz
Benchmarks
PassMark - G3D Mark	85 vs 48

Compare benchmarks

GPU 1: NVIDIA Quadro NVS 110M
GPU 2: ATI FireGL V3200

PassMark - G3D Mark

GPU 1

GPU 2

PassMark - G2D Mark

GPU 1

GPU 2

236

Name	NVIDIA Quadro NVS 110M	ATI FireGL V3200
PassMark - G3D Mark	48	85
PassMark - G2D Mark	236	236

Compare specifications (specs)

	NVIDIA Quadro NVS 110M	ATI FireGL V3200
Essentials
Architecture	Curie	Rage 9
Code name	G72	RV380
Launch date	1 June 2006	1 September 2004
Place in performance rating	742	731
Type	Mobile workstation	Workstation
Technical info
Boost clock speed	300 MHz
Core clock speed	300 MHz	500 MHz
Manufacturing process technology	90 nm	130 nm
Pipelines	4
Texture fill rate	1.2 GTexel / s	2 GTexel / s
Thermal Design Power (TDP)	10 Watt	46 Watt
Transistor count	112 million	75 million
Video outputs and ports
Display Connectors	No outputs	No outputs
Compatibility, dimensions and requirements
Interface	PCIe 1.0 x16	PCIe 1.0 x16
Supplementary power connectors	None	None
API support
DirectX	9.0c	9.0b
OpenGL	2.1	2.0
Memory
Maximum RAM amount	512 MB	128 MB
Memory bandwidth	4.8 GB / s	11.2 GB / s
Memory bus width	600 Bit	128 Bit
Memory clock speed	600 MHz	700 MHz
Memory type	64	DDR
Shared memory	0
Technologies
CineFX 4.0
Intellisample 4.0
PowerMizer 6.0
UltraShadow II