Nom de code de l’architecture |
Haswell |
Arrandale |
Date de sortie |
December 2013 |
4 December 2010 |
Position dans l’évaluation de la performance |
2604 |
2607 |
Processor Number |
G1820TE |
i3-390M |
Série |
Intel® Celeron® Processor G Series |
Legacy Intel® Core™ Processors |
Status |
Launched |
Discontinued |
Segment vertical |
Embedded |
Mobile |
Prix de sortie (MSRP) |
|
$39 |
Prix maintenant |
|
$38.95 |
Valeur pour le prix (0-100) |
|
16.49 |
Soutien de 64-bit |
|
|
Base frequency |
2.20 GHz |
2.66 GHz |
Bus Speed |
5 GT/s DMI2 |
2.5 GT/s DMI |
Taille de dé |
177 mm |
81 mm2 |
Cache L1 |
64 KB (per core) |
64 KB (per core) |
Cache L2 |
256 KB (per core) |
512 KB |
Cache L3 |
3072 KB (shared) |
3072 KB |
Processus de fabrication |
22 nm |
32 nm |
Température maximale de la caisse (TCase) |
72 °C |
|
Fréquence maximale |
2.2 GHz |
2.66 GHz |
Nombre de noyaux |
2 |
2 |
Nombre de fils |
2 |
4 |
Compte de transistor |
1400 million |
382 million |
Front-side bus (FSB) |
|
2500 MHz |
Température de noyau maximale |
|
90°C for rPGA, 105°C for BGA |
Soutien de la mémoire ECC |
|
|
Réseaux de mémoire maximale |
2 |
2 |
Bande passante de mémoire maximale |
21.3 GB/s |
17.1 GB/s |
Taille de mémore maximale |
32 GB |
8 GB |
Genres de mémoire soutenus |
DDR3 1333 |
DDR3 800/1066 |
Graphics base frequency |
350 MHz |
500 MHz |
Graphics max dynamic frequency |
1.00 GHz |
667 MHz |
Freéquency maximale des graphiques |
1 GHz |
667 MHz |
Intel® Flexible Display Interface (Intel® FDI) |
|
|
Intel® Quick Sync Video |
|
|
Mémoire de vidéo maximale |
1.7 GB |
|
Graphiques du processeur |
Intel HD Graphics |
Intel HD Graphics |
Technologie Intel® Clear Video HD |
|
|
Technologie Intel® Clear Video |
|
|
DisplayPort |
|
|
DVI |
|
|
eDP |
|
|
HDMI |
|
|
Nombre d’écrans soutenu |
3 |
2 |
VGA |
|
|
Low Halogen Options Available |
|
|
Nombre de CPUs maximale dans une configuration |
1 |
1 |
Package Size |
37.5mm x 37.5mm |
rPGA 37.5mmx 37.5mm, BGA 34mmx28mm |
Prise courants soutenu |
FCLGA1150 |
BGA1288, PGA988 |
Thermal Design Power (TDP) |
35 Watt |
35 Watt |
Thermal Solution |
PCG 2013A |
|
Nombre maximale des voies PCIe |
16 |
16 |
Révision PCI Express |
Up to 3.0 |
2.0 |
PCIe configurations |
Up to 1x16, 2x8, 1x8/2x4 |
1x16 |
Scalability |
1S Only |
|
Execute Disable Bit (EDB) |
|
|
Technologie Intel® Identity Protection |
|
|
Technologie Intel® Secure Key |
|
|
Technologie Intel® Trusted Execution (TXT) |
|
|
Technologie Enhanced Intel SpeedStep® |
|
|
Flexible Display interface (FDI) |
|
|
Idle States |
|
|
Extensions de l’ensemble d’instructions |
Intel® SSE4.1, Intel® SSE4.2 |
Intel® SSE4.1, Intel® SSE4.2 |
Intel 64 |
|
|
Intel® AES New Instructions |
|
|
Technologie Intel® Hyper-Threading |
|
|
Intel® Stable Image Platform Program (SIPP) |
|
|
Intel® TSX-NI |
|
|
Technologie Intel® Turbo Boost |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Thermal Monitoring |
|
|
Intel® Fast Memory Access |
|
|
Intel® Flex Memory Access |
|
|
Physical Address Extensions (PAE) |
|
36-bit |
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|