AMD Sempron 2650 vs Intel Core 2 Duo E6400

Comparative analysis of AMD Sempron 2650 and Intel Core 2 Duo E6400 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics API support, Compatibility, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

 

Differences

Reasons to consider the AMD Sempron 2650

  • Around 47% higher maximum core temperature: 90°C vs 61.4°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 28 nm vs 65 nm
  • 2x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 2.6x lower typical power consumption: 25 Watt vs 65 Watt
Maximum core temperature 90°C vs 61.4°C
Manufacturing process technology 28 nm vs 65 nm
L1 cache 128 KB vs 64 KB
Thermal Design Power (TDP) 25 Watt vs 65 Watt

Reasons to consider the Intel Core 2 Duo E6400

  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 72% better performance in PassMark - Single thread mark: 821 vs 477
  • Around 33% better performance in PassMark - CPU mark: 765 vs 574
  • Around 62% better performance in Geekbench 4 - Single Core: 244 vs 151
  • Around 63% better performance in Geekbench 4 - Multi-Core: 413 vs 253
Specifications (specs)
L2 cache 2048 KB vs 1 MB
Benchmarks
PassMark - Single thread mark 821 vs 477
PassMark - CPU mark 765 vs 574
Geekbench 4 - Single Core 244 vs 151
Geekbench 4 - Multi-Core 413 vs 253

Compare benchmarks

CPU 1: AMD Sempron 2650
CPU 2: Intel Core 2 Duo E6400

PassMark - Single thread mark
CPU 1
CPU 2
477
821
PassMark - CPU mark
CPU 1
CPU 2
574
765
Geekbench 4 - Single Core
CPU 1
CPU 2
151
244
Geekbench 4 - Multi-Core
CPU 1
CPU 2
253
413
Name AMD Sempron 2650 Intel Core 2 Duo E6400
PassMark - Single thread mark 477 821
PassMark - CPU mark 574 765
Geekbench 4 - Single Core 151 244
Geekbench 4 - Multi-Core 253 413
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 3.724
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 84.309
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.31
CompuBench 1.5 Desktop - Video Composition (Frames/s) 5.299
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 13.811

Compare specifications (specs)

AMD Sempron 2650 Intel Core 2 Duo E6400

Essentials

Family AMD Sempron
OPN PIB SD2650JAHMBOX
OPN Tray SD2650JAH23HM
Place in performance rating 2820 2829
Series AMD Sempron Dual-Core APU Legacy Intel® Core™ Processors
Vertical segment Desktop Desktop
Architecture codename Conroe
Launch date July 2006
Price now $19.95
Processor Number E6400
Status Discontinued
Value for money (0-100) 19.03

Performance

Base frequency 1.45 GHz 2.13 GHz
L1 cache 128 KB 64 KB
L2 cache 1 MB 2048 KB
Manufacturing process technology 28 nm 65 nm
Maximum core temperature 90°C 61.4°C
Number of cores 2 2
Number of threads 2
Unlocked
64 bit support
Bus Speed 1066 MHz FSB
Die size 111 mm2
Maximum frequency 2.13 GHz
Transistor count 167 million
VID voltage range 0.8500V-1.5V

Memory

Max memory channels 1
Supported memory frequency 1333 MHz
Supported memory types DDR1, DDR2, DDR3

Graphics

Enduro
Graphics max frequency 400 MHz
iGPU core count 128
Processor graphics AMD Radeon R3 Graphics
Switchable graphics
Unified Video Decoder (UVD)
Video Codec Engine (VCE)

Graphics interfaces

DisplayPort
HDMI

Graphics API support

DirectX 12
Vulkan

Compatibility

Sockets supported AM1 PLGA775, LGA775
Thermal Design Power (TDP) 25 Watt 65 Watt
Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size 37.5mm x 37.5mm
Scenario Design Power (SDP) 0 W

Advanced Technologies

AMD App Acceleration
AMD Elite Experiences
AMD HD3D technology
Enhanced Virus Protection (EVP)
Fused Multiply-Add 4 (FMA4)
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
PowerGating
PowerNow
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring

Virtualization

AMD Virtualization (AMD-V™)
IOMMU 2.0
Intel® Virtualization Technology (VT-x)

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)