Intel Celeron G1820TE vs AMD Athlon II M340

Comparative analysis of Intel Celeron G1820TE and AMD Athlon II M340 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.

Intel Celeron G1820TE

AMD Athlon II M340

Differences

Reasons to consider the Intel Celeron G1820TE

CPU is newer: launch date 4 year(s) 2 month(s) later
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
Around 14% better performance in PassMark - Single thread mark: 978 vs 858
Around 26% better performance in PassMark - CPU mark: 1020 vs 807

Specifications (specs)
Launch date	December 2013 vs 10 September 2009
Manufacturing process technology	22 nm vs 45 nm
Benchmarks
PassMark - Single thread mark	978 vs 858
PassMark - CPU mark	1020 vs 807

Reasons to consider the AMD Athlon II M340

2x more L2 cache, more data can be stored in the L2 cache for quick access later

L2 cache	1024 KB vs 256 KB (per core)

Compare benchmarks

CPU 1: Intel Celeron G1820TE
CPU 2: AMD Athlon II M340

PassMark - Single thread mark

CPU 1

CPU 2

978

858

PassMark - CPU mark

CPU 1

CPU 2

1020

807

Name	Intel Celeron G1820TE	AMD Athlon II M340
PassMark - Single thread mark	978	858
PassMark - CPU mark	1020	807
3DMark Fire Strike - Physics Score	882

Compare specifications (specs)

	Intel Celeron G1820TE	AMD Athlon II M340
Essentials
Architecture codename	Haswell	Caspian
Launch date	December 2013	10 September 2009
Place in performance rating	2604	2480
Processor Number	G1820TE
Series	Intel® Celeron® Processor G Series	AMD Athlon II
Status	Launched
Vertical segment	Embedded	Laptop
Performance
64 bit support
Base frequency	2.20 GHz
Bus Speed	5 GT/s DMI2
Die size	177 mm
L1 cache	64 KB (per core)	128 KB
L2 cache	256 KB (per core)	1024 KB
L3 cache	3072 KB (shared)
Manufacturing process technology	22 nm	45 nm
Maximum case temperature (TCase)	72 °C
Maximum frequency	2.2 GHz	2.2 GHz
Number of cores	2	2
Number of threads	2	2
Transistor count	1400 million
Front-side bus (FSB)		3200 MHz
Memory
ECC memory support
Max memory channels	2
Maximum memory bandwidth	21.3 GB/s
Maximum memory size	32 GB
Supported memory types	DDR3 1333
Graphics
Graphics base frequency	350 MHz
Graphics max dynamic frequency	1.00 GHz
Graphics max frequency	1 GHz
Intel® Flexible Display Interface (Intel® FDI)
Intel® Quick Sync Video
Max video memory	1.7 GB
Processor graphics	Intel HD Graphics
Graphics interfaces
DisplayPort
DVI
eDP
HDMI
Number of displays supported	3
VGA
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	37.5mm x 37.5mm
Sockets supported	FCLGA1150	Socket S1 (S1g3)
Thermal Design Power (TDP)	35 Watt	35 Watt
Thermal Solution	PCG 2013A
Peripherals
Max number of PCIe lanes	16
PCI Express revision	Up to 3.0
PCIe configurations	Up to 1x16, 2x8, 1x8/2x4
Scalability	1S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
PowerNow
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)