Intel Pentium G3320TE vs AMD A4-5150M

Comparative analysis of Intel Pentium G3320TE and AMD A4-5150M processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Pentium G3320TE

AMD A4-5150M

Differences

Reasons to consider the Intel Pentium G3320TE

A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
Around 64% better performance in PassMark - Single thread mark: 1312 vs 800
2.1x better performance in PassMark - CPU mark: 1570 vs 765

Specifications (specs)
Manufacturing process technology	22 nm vs 32 nm
Benchmarks
PassMark - Single thread mark	1312 vs 800
PassMark - CPU mark	1570 vs 765

Reasons to consider the AMD A4-5150M

Around 46% higher maximum core temperature: 105 °C vs 72°C

Maximum core temperature	105 °C vs 72°C

Compare benchmarks

CPU 1: Intel Pentium G3320TE
CPU 2: AMD A4-5150M

PassMark - Single thread mark

CPU 1

CPU 2

1312

800

PassMark - CPU mark

CPU 1

CPU 2

1570

765

Name	Intel Pentium G3320TE	AMD A4-5150M
PassMark - Single thread mark	1312	800
PassMark - CPU mark	1570	765
Geekbench 4 - Single Core		1749
Geekbench 4 - Multi-Core		2416

Compare specifications (specs)

	Intel Pentium G3320TE	AMD A4-5150M
Essentials
Architecture codename	Haswell	Richland
Launch date	Q3'13	12 March 2013
Place in performance rating	1928	1925
Processor Number	G3320TE
Series	Intel® Pentium® Processor G Series	AMD A-Series
Status	Launched
Vertical segment	Embedded	Laptop
Performance
64 bit support
Base frequency	2.30 GHz
Bus Speed	5 GT/s DMI2
Manufacturing process technology	22 nm	32 nm
Maximum core temperature	72°C	105 °C
Number of cores	2	2
Number of QPI Links	1
Number of threads	2	2
Die size		246 mm
L1 cache		96 KB
L2 cache		1 MB
Maximum case temperature (TCase)		105 °C
Maximum frequency		3.3 GHz
Transistor count		1300 Million
Memory
Max memory channels	2
Maximum memory bandwidth	21.3 GB/s
Maximum memory size	32 GB
Supported memory types	DDR3-1333, DDR3L-1333 @ 1.5V	DDR3
Graphics
Graphics base frequency	350 MHz
Graphics max dynamic frequency	1.00 GHz
Intel® Clear Video HD technology
Intel® Quick Sync Video
Max video memory	1 GB
Processor graphics	Intel HD Graphics
Graphics interfaces
DisplayPort
DVI
eDP
HDMI
Number of displays supported	3
VGA
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm
Sockets supported	FCLGA1150	FS1r2
Thermal Design Power (TDP)	35 Watt	35 Watt
Thermal Solution	PCG 2013A
Peripherals
Max number of PCIe lanes	16
PCI Express revision	3.0
PCIe configurations	Up to 1x16, 2x8, 1x8/2x4
Security & Reliability
Execute Disable Bit (EDB)
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)