Intel Iris Xe Graphics G4 vs AMD Radeon RX 540 OEM

Comparative analysis of Intel Iris Xe Graphics G4 and AMD Radeon RX 540 OEM videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark, Geekbench - OpenCL, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).

 

Differences

Reasons to consider the Intel Iris Xe Graphics G4

  • Videocard is newer: launch date 3 year(s) 4 month(s) later
  • Around 35% higher texture fill rate: 52.80 GTexel/s vs 39.01 GTexel/s
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 10 nm vs 28 nm
  • 4.3x lower typical power consumption: 15 Watt vs 65 Watt
  • Around 42% better performance in PassMark - G3D Mark: 2686 vs 1896
  • Around 3% better performance in PassMark - G2D Mark: 371 vs 361
  • Around 28% better performance in Geekbench - OpenCL: 12010 vs 9416
  • Around 61% better performance in GFXBench 4.0 - Manhattan (Frames): 3708 vs 2296
  • Around 61% better performance in GFXBench 4.0 - Manhattan (Fps): 3708 vs 2296
Specifications (specs)
Launch date 2 Sep 2020 vs 18 April 2017
Texture fill rate 52.80 GTexel/s vs 39.01 GTexel/s
Manufacturing process technology 10 nm vs 28 nm
Thermal Design Power (TDP) 15 Watt vs 65 Watt
Benchmarks
PassMark - G3D Mark 2686 vs 1896
PassMark - G2D Mark 371 vs 361
Geekbench - OpenCL 12010 vs 9416
GFXBench 4.0 - Manhattan (Frames) 3708 vs 2296
GFXBench 4.0 - Manhattan (Fps) 3708 vs 2296

Reasons to consider the AMD Radeon RX 540 OEM

  • 4.1x more core clock speed: 1219 MHz vs 300 MHz
  • Around 11% higher boost clock speed: 1219 MHz vs 1100 MHz
  • Around 33% higher pipelines: 512 vs 384
Core clock speed 1219 MHz vs 300 MHz
Boost clock speed 1219 MHz vs 1100 MHz
Pipelines 512 vs 384

Compare benchmarks

GPU 1: Intel Iris Xe Graphics G4
GPU 2: AMD Radeon RX 540 OEM

PassMark - G3D Mark
GPU 1
GPU 2
2686
1896
PassMark - G2D Mark
GPU 1
GPU 2
371
361
Geekbench - OpenCL
GPU 1
GPU 2
12010
9416
GFXBench 4.0 - Manhattan (Frames)
GPU 1
GPU 2
3708
2296
GFXBench 4.0 - Manhattan (Fps)
GPU 1
GPU 2
3708
2296
Name Intel Iris Xe Graphics G4 AMD Radeon RX 540 OEM
PassMark - G3D Mark 2686 1896
PassMark - G2D Mark 371 361
Geekbench - OpenCL 12010 9416
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 79.73
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 1136.391
CompuBench 1.5 Desktop - T-Rex (Frames/s) 4.584
CompuBench 1.5 Desktop - Video Composition (Frames/s) 61.715
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 193.592
GFXBench 4.0 - Car Chase Offscreen (Frames) 5609
GFXBench 4.0 - Manhattan (Frames) 3708 2296
GFXBench 4.0 - T-Rex (Frames) 3356
GFXBench 4.0 - Car Chase Offscreen (Fps) 5609
GFXBench 4.0 - Manhattan (Fps) 3708 2296
GFXBench 4.0 - T-Rex (Fps) 3356

Compare specifications (specs)

Intel Iris Xe Graphics G4 AMD Radeon RX 540 OEM

Essentials

Architecture Generation 12.0 GCN 3.0
Code name Tiger Lake GT1 Cape Verde
Launch date 2 Sep 2020 18 April 2017
Place in performance rating 626 627
Type Laptop Laptop
Design Radeon RX 500 Series
GCN generation 3rd Gen

Technical info

Boost clock speed 1100 MHz 1219 MHz
Compute units 48 8
Core clock speed 300 MHz 1219 MHz
Manufacturing process technology 10 nm 28 nm
Peak Double Precision (FP64) Performance 211.2 GFLOPS
Peak Half Precision (FP16) Performance 1.690 TFLOPS
Peak Single Precision (FP32) Performance 844.8 GFLOPS
Pipelines 384 512
Pixel fill rate 13.20 GPixel/s 19.50 GP/s
Texture fill rate 52.80 GTexel/s 39.01 GTexel/s
Thermal Design Power (TDP) 15 Watt 65 Watt
Floating-point performance 1.2 TFLOPs
Render output units 16
Stream Processors 512
Texture Units 32
Transistor count 1,500 million

Video outputs and ports

Display Connectors No outputs
DisplayPort support
Dual-link DVI support
HDMI
VGA

Compatibility, dimensions and requirements

Interface PCIe 3.0 x1 PCIe 3.0 x16
Width IGP
Supplementary power connectors 1x 6-pin

API support

DirectX 12.1 12
OpenCL 2.1 2.0
OpenGL 4.6 4.5
Shader Model 6.4
Vulkan

Memory

Maximum RAM amount 4 GB
Memory bandwidth 96 GB/s
Memory bus width 128 bit
Memory clock speed 6000 MHz
Memory type GDDR5

Technologies

4K H264 Decode
4K H264 Encode
AMD Eyefinity
AMD Radeon™ Chill
AMD Radeon™ ReLive
AppAcceleration
Enduro
FreeSync
H265/HEVC Decode
H265/HEVC Encode
HDMI 4K Support
PowerTune
TressFX
TrueAudio
Unified Video Decoder (UVD)
Video Code Engine (VCE)